patentstorm.us 258 85 http://www.patentstorm.us/ http://www.patentstorm.us/images/logo.gif PatentStorm -> Applications -> Electricity: conductors and insulators http://www.patentstorm.us/rss/class/applications/rss-174.xml Recent patent applications filings in USPTO Class 174 Electricity: conductors and insulators. Thu, 16 Feb 2012 15:00:42 patents@patentstorm.us en <![CDATA[SUPERCONDUCTIVE ELECTRIC CABLE]]> http://www.patentstorm.us/applications/20120040841/description.html
  • Application Number:  20120040841
  • Publication Date:  2012-02-16
  • Inventors:  Schmidt, Frank; Soika, Rainer
    • The invention relates to a superconductive electric cable (SK) that has at least one superconductive conductor (1) that consists of strips or wires that are wrapped in at least one layer around a support designed as a tube (2). The tube (2) is elastically deformable and has a gap (8) extending over its entire length in an axial ...
    ]]>     20120040841     <![CDATA[METHOD FOR PRODUCING METAL LAMINATED SUBSTRATE FOR OXIDE SUPERCONDUCTING WIRE, AND OXIDE SUPERCONDUCTING WIRE USING THE SUBSTRATE]]> http://www.patentstorm.us/applications/20120040840/description.html
  • Application Number:  20120040840
  • Publication Date:  2012-02-16
  • Inventors:  Konishi, Masaya; Kaneko, Akira; Okayama, Hironao; Kato, Takeshi
    • [Problem]

    A metal laminated substrate for an oxide superconducting wire is provided at a low cost. The metal laminated substrate has high strength, and stable high biaxial orientation in the longitudinal direction.

    [Means for Resolution]

    A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and ...
    ]]> 20120040840 <![CDATA[Component arrangement and method for production thereof]]> http://www.patentstorm.us/applications/20120039056/description.html

  • Application Number:  20120039056
  • Publication Date:  2012-02-16
  • Inventors:  Oppermann, Hans-Hermann; Wolf, Juergen; Klein, Mathias; Toepper, Michael
    • The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer ...
    ]]>     20120039056     <![CDATA[SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM]]> http://www.patentstorm.us/applications/20120039053/description.html
  • Application Number:  20120039053
  • Publication Date:  2012-02-16
  • Inventors:  McDonald, David L.; Slaton, David S.; Perlaguri, Shreenath S.
    • A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one ...
    ]]>     20120039053     <![CDATA[LAMP ENVELOPE AND LED LAMP USING THE SAME]]> http://www.patentstorm.us/applications/20120038260/description.html
  • Application Number:  20120038260
  • Publication Date:  2012-02-16
  • Inventors:  LU, YING-CHIEH; CHIANG, KUO-FENG; HUANG, HSIN-FEI; CHEN, YU-SHU; HUANG, ZHENG-JAY; LO, KUO-MANG
    • An LED lamp includes a lamp holder, a heat sink, a light source and an envelope. The lamp holder is configured for electrically connecting with a power source. The heat sink is connected to the lamp holder. The light source is mounted on the heat sink. The envelope is mounted on the heat sink and covers the light source. The envelope has a light incident surface and a light output surface opposite to the light incident surface. A plurality of lens are formed on the lamp envelope and configured ...
    ]]>     20120038260     <![CDATA[DRY MICA TAPE AND INSULATION COILS MANUFACTURED THEREWITH]]> http://www.patentstorm.us/applications/20120038239/description.html
  • Application Number:  20120038239
  • Publication Date:  2012-02-16
  • Inventors:  Morooka, Hisashi; Haraguchi, Yoshihiro; Maruyama, Shoichi; Ilzuka, Motonobu; IKEDA, Kenji; Hiruta, Naohiro
    • A dry mica tape includes a base material, a binder resin layer A formed on the base material and including an epoxy resin and an accelerator, a mica paper layer formed in contact with the binder resin layer A, and a binder resin layer B formed in contact with the mica paper layer, including an epoxy resin, and providing a cured resin with a higher glass transition point than that of a cured resin of an impregnating varnish only by reacting with an impregnating varnish including an epoxy resin ...
    ]]>     20120038239     <![CDATA[ALUMINUM NITRIDE SUBSTRATE, ALUMINUM NITRIDE CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING ALUMINUM NITRIDE SUBSTRATE]]> http://www.patentstorm.us/applications/20120038038/description.html
  • Application Number:  20120038038
  • Publication Date:  2012-02-16
  • Inventors:  Fukuda, Yoshiyuki; Yamaguchi, Haruhiko
    • The present invention provides an aluminum nitride substrate and an aluminum nitride circuit board having excellent insulation characteristics and heat dissipation properties and having high strength, a semiconductor apparatus, and a method for manufacturing an aluminum nitride substrate.

    An aluminum nitride substrate according to the present invention is an aluminum nitride substrate having aluminum nitride as a main component and comprising a polycrystal ...
    ]]> 20120038038 <![CDATA[ELECTRONIC DEVICE PROTECTION]]> http://www.patentstorm.us/applications/20120037420/description.html

  • Application Number:  20120037420
  • Publication Date:  2012-02-16
  • Inventors:  Lam, Tai A.; Tanielian, Minas H.
    • Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh, where each conductive member of a cell is separated from conductive members of adjacent cells by a gap and a cavity is defined in the non-conductive substrate at a location of each ...
    ]]>     20120037420     <![CDATA[CABLE TERMINATION APPARATUS AND RELATED METHODS]]> http://www.patentstorm.us/applications/20120037419/description.html
  • Application Number:  20120037419
  • Publication Date:  2012-02-16
  • Inventors:  Mech, Konrad; Spira, Brian
    • In one embodiment, the termination apparatus provides a means for terminating certain elongate heat tracing products that have corrugated metal sheaths as outer covering for those elongate heaters. The heat tracing products may include oval corrugated metal sheaths as outer covering. Terminating other types of cables, including cables which provide electrical power or electromagnetic signals, is also ...
    ]]>     20120037419     <![CDATA[MOUNTING ARRANGEMENT FOR MOUNTING SYSTEMS AND AIRCRAFT OR SPACECRAFT]]> http://www.patentstorm.us/applications/20120037418/description.html
  • Application Number:  20120037418
  • Publication Date:  2012-02-16
  • Inventors:  Kosiankowski, Lueder; Lunitz, Barbara; Zyrull, Doris; Juenemann, Marcus; Guthke, Hans Peter
    • The present invention provides a mounting arrangement for mounting at least one electrical line on a structure, in particular of an aircraft or spacecraft, said mounting arrangement comprising: at least one module which comprises at least one terminal for connecting the electrical line; and a substantially U-shaped holder which comprises a central portion for mounting the electrical line for strain relief thereof and two side portions which are connected to the respective ends of the central ...
    ]]>     20120037418     <![CDATA[REMOVABLE PUSH ELECTRICAL FITTING FOR ELECTRICAL METALLIC TUBING OR EMT]]> http://www.patentstorm.us/applications/20120037417/description.html
  • Application Number:  20120037417
  • Publication Date:  2012-02-16
  • Inventor:  SMITH, Lawrence J.
    • An electrical fitting having a gripping device with a plurality of gripping tabs forming a helix or spiral. The electrical fitting permits electrical metallic tubing or EMT to be quickly attached to and removed from the electrical fitting without disassembling the fitting or cutting the tubing. A body with a locking end having a plurality of griping tabs receives an end of the tubing pushed into the fitting. The gripping tabs securely hold the tubing preventing loosening or removal. The helix ...
    ]]>     20120037417     <![CDATA[DOUBLE-PACKING CABLE AND FLEXIBLE CONDUIT GLAND]]> http://www.patentstorm.us/applications/20120037416/description.html
  • Application Number:  20120037416
  • Publication Date:  2012-02-16
  • Inventor:  CHIOU, Jiun Wei
    • A double-packing cable and flexible conduit gland for securing a cable and a flexible conduit to a box member, including a casing having a tapered inner surface portion and a first outer thread, a packing member inserted into the casing and defining a first packing segment compressible to clamp on the flexible conduit, a second packing segment compressible to clamp on the cable, a tapered outer surface located on the second packing segment and stopped against the tapered inner surface portion ...
    ]]>     20120037416     <![CDATA[CARRIER FOR A CONTROL UNIT OF A MOTOR VEHICLE, CONTROL UNIT AND MOTOR VEHICLE]]> http://www.patentstorm.us/applications/20120037415/description.html
  • Application Number:  20120037415
  • Publication Date:  2012-02-16
  • Inventor:  DEMMA, Dino
    • A carrier is provided for a control unit of a motor vehicle. The carrier includes, but is not limited to at least one material section for fastening to the body of a motor vehicle. It is provided that the carrier is designed for receiving at least two control units, which via an insertion region of the carrier can be mounted to the carrier from the same side. A control unit is also provided for installation in a carrier and a motor vehicle is provided with a ...
    ]]>     20120037415     <![CDATA[MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME]]> http://www.patentstorm.us/applications/20120037414/description.html
  • Application Number:  20120037414
  • Publication Date:  2012-02-16
  • Inventor:  Tanaka, Hironori
    • A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insulation layer is provided on the first insulation layer and the capacitor section, and a metal thin-film layer is provided over the capacitor section and on the second insulation layer. An outermost interlayer resin insulation layer is ...
    ]]>     20120037414     <![CDATA[PRINTED WIRING BOARD FABRICATION METHOD, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE]]> http://www.patentstorm.us/applications/20120037413/description.html
  • Application Number:  20120037413
  • Publication Date:  2012-02-16
  • Inventor:  Kaneda, Kenichi
    • An object of the invention is to provide a method for fabricating a printed wiring board that can suppress warping of the printed wiring board and can improve the yield of semiconductor chip mounting and enhance the reliability of a semiconductor package. The printed wiring board fabrication method according to the invention is a method for fabricating a printed wiring board having a through-hole in a core layer, wherein the printed wiring board fabrication method includes the step of applying ...
    ]]>     20120037413     <![CDATA[Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough]]> http://www.patentstorm.us/applications/20120037412/description.html
  • Application Number:  20120037412
  • Publication Date:  2012-02-16
  • Inventor:  REINMUTH, Jochen
    • A method is described for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough. The method has the following operations of forming the electrical feedthrough so that it extends through the substrate from the front side to the back side of the substrate, forming a first closing layer on a front side of the substrate, forming an annular isolation trench in the substrate which encloses the electrical feedthrough, using an etching process starting ...
    ]]>     20120037412     <![CDATA[PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENT AND FABRICATION METHOD THEREOF]]> http://www.patentstorm.us/applications/20120037411/description.html
  • Application Number:  20120037411
  • Publication Date:  2012-02-16
  • Inventors:  Hsu, Shih-Ping; Zeng, Zhao-Chong
    • A packaging substrate includes: a core board with at least a cavity; a dielectric layer unit having upper and lower surfaces and encapsulating the core board and filling the cavity; a plurality of positioning pads embedded in the lower surface of the dielectric layer unit; at least a passive component having upper and lower surfaces with electrode pads disposed thereon and embedded in the dielectric layer unit so as to be received in the cavity of the core board at a position corresponding to ...
    ]]>     20120037411     <![CDATA[THERMOPLASTIC RESIN COMPOSITION, ADHESIVE FILM AND WIRING FILM USING THE SAME]]> http://www.patentstorm.us/applications/20120037410/description.html
  • Application Number:  20120037410
  • Publication Date:  2012-02-16
  • Inventors:  Akutsu, Nobuhito; Amou, Satoru; Abe, Tomiya; Kuwabara, Kosuke
    • A thermoplastic resin composition including a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated ...
    ]]>     20120037410     <![CDATA[METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD OBTAINED THEREBY]]> http://www.patentstorm.us/applications/20120037409/description.html
  • Application Number:  20120037409
  • Publication Date:  2012-02-16
  • Inventors:  Umeda, Hiroaki; Yamaguchi, Norihiro; Yukawa, Ken
    • In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using ...
    ]]>     20120037409     <![CDATA[METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME]]> http://www.patentstorm.us/applications/20120037408/description.html
  • Application Number:  20120037408
  • Publication Date:  2012-02-16
  • Inventors:  CHANG, Myung Whun; LEE, Dae Hyeong; HONG, Ki Pyo
    • There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling ...
    ]]>     20120037408     <![CDATA[Electronic Apparatus and Method of Manufacturing the Same]]> http://www.patentstorm.us/applications/20120037407/description.html
  • Application Number:  20120037407
  • Publication Date:  2012-02-16
  • Inventors:  Tanaka, Kouji; Ohmi, Tadahiro; Asahara, Hirokazu; Watanuki, Kohei
    • It has been found out that, among transparent conductive layers, a zinc oxide layer has a function of preventing diffusion of sodium. An electronic apparatus is obtained which uses the zinc oxide layer as an electrode of the electronic apparatus and also as a diffusion preventing layer for preventing diffusion of sodium from a glass ...
    ]]>     20120037407     <![CDATA[METHOD AND APPARATUS FOR USING FLEX CIRCUIT TECHNOLOGY TO CREATE AN ELECTRODE]]> http://www.patentstorm.us/applications/20120037406/description.html
  • Application Number:  20120037406
  • Publication Date:  2012-02-16
  • Inventor:  Curry, Kenneth M.
    • A method of creating an active electrode that may include providing a flex circuit having an electrode made of a first material and providing a first mask over the flex circuit, the first mask having an offset region and an opening that exposes the electrode. The method may also include depositing a second material over the offset region and the opening, the second material being different from the first material and providing a second mask over the second material, the second mask having an ...
    ]]>     20120037406     <![CDATA[FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME]]> http://www.patentstorm.us/applications/20120037405/description.html
  • Application Number:  20120037405
  • Publication Date:  2012-02-16
  • Inventors:  Hamazawa, Akihisa; Nishimura, Koji; Goda, Hideki
    • An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer ...
    ]]>     20120037405     <![CDATA[PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN AND METHOD OF FABRICATING THE SAME]]> http://www.patentstorm.us/applications/20120037404/description.html
  • Application Number:  20120037404
  • Publication Date:  2012-02-16
  • Inventors:  Hsu, Shih- Ping; Zeng, Zhao-Chong
    • A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in the dielectric layer unit and corresponding to the positioning pad; a first circuit layer disposed on the top surface of the dielectric layer unit, the first circuit layer having first ...
    ]]>     20120037404     <![CDATA[Method for Electrically Conductively Connecting Conductor Tracks in Conductor Carriers and System Comprising such Conductor Carriers]]> http://www.patentstorm.us/applications/20120037403/description.html
  • Application Number:  20120037403
  • Publication Date:  2012-02-16
  • Inventor:  Liskow, Uwe
    • A method for electrically conductively connecting conductor tracks in conductor carriers, preferably printed circuit boards or conductor foils is disclosed. A first and second conductor carrier are provided, into which a respective conductor track is embedded, which are exposed at a contact region. For the purpose of fusing the material of the conductor tracks, said material is subjected to punctiform heating via the in the opposite direction to the exposed contact region of the first conductor ...
    ]]>     20120037403     <![CDATA[ELECTRIC WIRE HOLDER]]> http://www.patentstorm.us/applications/20120037402/description.html
  • Application Number:  20120037402
  • Publication Date:  2012-02-16
  • Inventor:  Kawase, Harumi
    • An object of the invention is to provide an electric wire holder capable of facilitating an end treatment of a wiring harness to reduce the fabrication cost of the wiring harness and of increasing the reliability in the insulation displacement connection at the end portion of the wiring harness. In an electric wire holder 1 including a holder main body 5 which holds a plurality of electric wires 3 in parallel with an electric wire alignment portion 11 and a holder ...
    ]]>     20120037402     <![CDATA[WALL MOUNTED TELEVISION CABLE AND CORD ORGANIZING APPARATUS]]> http://www.patentstorm.us/applications/20120037401/description.html
  • Application Number:  20120037401
  • Publication Date:  2012-02-16
  • Inventors:  PASTORIZA, ROBERT; LOZANO, DANIEL
    • A home theatre cable and cord organizing apparatus comprising essentially of a cable and cord storage compartment having a mounting flange, a power strip receiving port, a removably attachable access plate composed of a material to which paint will adhere, and a plurality of mounting clips. The mounting flange in cooperation with the mounting clips allow for easy installation once an appropriately sized hole is created. With the storage compartment secured in place, the user has an opening from ...
    ]]>     20120037401     <![CDATA[ELECTRICALLY ISOLATING POLYMER COMPOSITION]]> http://www.patentstorm.us/applications/20120037400/description.html
  • Application Number:  20120037400
  • Publication Date:  2012-02-16
  • Inventors:  Fields, Lenwood L.; Thelen, Dean M.; Martin, Arthur W.; O'Malley, Shawn M.
    • A composition that includes at least one crosslinkable monomer; at least one hydrophobic monomer; and at least one dielectric constant enhancing agent selected from dielectric enhancing monomers, ferroelectric particulates, and electroactive polymers. Coatings including the polymer of compositions, and articles including electrically isolating layers are also ...
    ]]>     20120037400     <![CDATA[ANISOTROPIC CONDUCTIVE FILM AND METHOD OF FABRICATING THE SAME]]> http://www.patentstorm.us/applications/20120037399/description.html
  • Application Number:  20120037399
  • Publication Date:  2012-02-16
  • Inventors:  HSIAO, Chien-Chih; CHIANG, Chin-Hsin
    • A method of fabricating anisotropic conductive film comprises the steps of: mixing conductive particles, a resin material and a solvent to form slurry; and providing a separate means for progressively distributing the conductive particles on one side of the resin material when forming the anisotropic conductive film from slurry. The method disclosed in the present invention is easy to use, and the anisotropic conductive film fabricated by the method has high conductive particles capturing ...
    ]]>     20120037399     <![CDATA[ETHYLENE/TETRAFLUOROETHYLENE COPOLYMER, ELECTRICAL WIRE, AND FLUORINE RESIN POWDER FOR ROTATIONAL MOLDING]]> http://www.patentstorm.us/applications/20120037398/description.html
  • Application Number:  20120037398
  • Publication Date:  2012-02-16
  • Inventors:  Ichikawa, Kenji; Sagisaka, Shigehito; Hirao, Takayuki; Nakano, Yumi
    • The present invention provides an ethylene/tetrafluoroethylene copolymer showing good heat resistance and good crack resistance even in a high temperature environment. The present invention is an ethylene/tetrafluoroethylene copolymer, comprising: copolymerization units derived from ethylene; tetrafluoroethylene; and a fluorine-containing vinyl monomer represented by general formula: CH2=CH−Rf in the formula, Rf representing a perfluoroalkyl group containing four or more carbon ...
    ]]>     20120037398     <![CDATA[POLYMER COMPOSITIONS AND THEIR USE AS CABLE COVERINGS]]> http://www.patentstorm.us/applications/20120037397/description.html
  • Application Number:  20120037397
  • Publication Date:  2012-02-16
  • Inventor:  MHETAR, Vijay
    • The present invention relates to a crosslinked polymer containing polyphenylene sulfide (PSS) and an impact modifier, and its use as cable coverings, such as jacket or insulation. The composition contains a crosslinked polymer containing of polyphenylene sulfide (PPS) and an impact modifier. Preferably, the impact modifier is present at about 20-50 percent (by weight of the total composition), preferably about 20-30 percent; and PPS is present at about 50-80 percent (by weight of the total ...
    ]]>     20120037397     <![CDATA[FLAME RETARDANT THERMOPLASTIC ELASTOMERS]]> http://www.patentstorm.us/applications/20120037396/description.html
  • Application Number:  20120037396
  • Publication Date:  2012-02-16
  • Inventor:  Gu, Jiren
    • A flame-retardant thermoplastic elastomer compound is disclosed having polyphenylene ether, a hydrogenated styrene block copolymer, at least one solid non-halogenated phosphorus containing flame retardant, and a nucleated olefinic polymer. The compound has a before-aging tensile elongation of >200% and an after-aging tensile elongation residual of at least 75%, according to the UL 62 test, which makes it useful as an insulation layer, a jacketing layer, or both for protected electrical lines ...
    ]]>     20120037396     <![CDATA[ENCAPSULATION HOUSING REDUCING PIECE]]> http://www.patentstorm.us/applications/20120037395/description.html
  • Application Number:  20120037395
  • Publication Date:  2012-02-16
  • Inventors:  Beutel, Stefan; Kleinschmidt, Andreas
    • An encapsulation housing reducing piece has a first flange and a second flange. The second flange has a reduced cross-section compared to the first flange. An encapsulation housing shell extends between the two flanges. The encapsulation housing shell has a plurality of even zones. Rotation symmetrical shell surface sections are arranged between the even ...
    ]]>     20120037395     <![CDATA[MICRO COAXIAL CABLE AND LASER BEAM SHIELDING RESIN COMPOSITION]]> http://www.patentstorm.us/applications/20120037394/description.html
  • Application Number:  20120037394
  • Publication Date:  2012-02-16
  • Inventors:  TANAKA, Yuuki; KOJIMA, Shigeru
    • An micro coaxial cable is disclosed, which includes: a center conductor (3) that enables transfer of a signal; an insulator (5) that covers a periphery of the center conductor (3); an external conductor (8) as a shield that covers a periphery of the insulator (5); and a jacket (8) that covers a periphery of the external conductor (8), in which the insulator (5) is formed of a resin composition containing insulating resin, carbon black and ...
    ]]>     20120037394     <![CDATA[DEVICE FOR GROUNDING]]> http://www.patentstorm.us/applications/20120037393/description.html
  • Application Number:  20120037393
  • Publication Date:  2012-02-16
  • Inventor:  Dahl, Fredrik
    • Device for establishing an efficient grounding of an installation of different types includes one or more cables, wherein the ground rail or ground conductor, ground rails or ground conductors or ground point or ground points of the installation being grounded by the one or more cables including a combination of electrically conductive wires or conductors in at least one inner core and at least one outer layer which surrounds the inner core wholly or partly, and the cable or the cables are laid ...
    ]]>     20120037393     <![CDATA[CORD PLATE FOR PHOTOVOLTAIC MODULE]]> http://www.patentstorm.us/applications/20120037202/description.html
  • Application Number:  20120037202
  • Publication Date:  2012-02-16
  • Inventor:  Gosnell, Justin C.
    • A cord plate for a photovoltaic module is configured to receive one or more flowable ...
    ]]>     20120037202     <![CDATA[ELECTRICAL CONNECTORS AND PRINTED CIRCUITS HAVING BROADSIDE-COUPLING REGIONS]]> http://www.patentstorm.us/applications/20120034822/description.html
  • Application Number:  20120034822
  • Publication Date:  2012-02-09
  • Inventors:  BOPP, STEVEN RICHARD; NAY, NEIL KTUL
    • An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. ...
    ]]>     20120034822     <![CDATA[HANDHELD ELECTRONIC DEVICE INCLUDING MULTI-COMPARTMENT SHIELDING CONTAINER AND ASSOCIATED METHODS]]> http://www.patentstorm.us/applications/20120033398/description.html
  • Application Number:  20120033398
  • Publication Date:  2012-02-09
  • Inventors:  PAPKE, Jana Lynn; CHEN, Chao; FREGIN, Douglas
    • A handheld electronic device may include a portable housing and a shielding container within the portable housing. The shielding container may include a shielding frame and a shielding lid carried thereby. A printed circuit board may be within the shielding container. The shielding frame may include a planar base with at least one opening therein, a pair of opposing side walls integrally formed with the base and extending upwardly therefrom, and a pair of opposing end walls integrally formed ...
    ]]>     20120033398     <![CDATA[DEVICE HAVING ANTI-DEMOLITION FUNCTIONS]]> http://www.patentstorm.us/applications/20120033390/description.html
  • Application Number:  20120033390
  • Publication Date:  2012-02-09
  • Inventors:  Yang, Wan-Ru; Chen, Hui-Shan; Peng, Chih-An
    • A device having anti-demolition functions includes a housing and an electronic apparatus. The housing includes a first cover and a second cover. The first cover has a first connection part disposed thereon. The electronic apparatus is disposed in the housing and is fixed on the second cover. The electronic apparatus includes a first block, a second block and a join part. The second block has a second connection part disposed thereon, wherein second connection part fastens first connection part ...
    ]]>     20120033390     <![CDATA[COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME]]> http://www.patentstorm.us/applications/20120033367/description.html
  • Application Number:  20120033367
  • Publication Date:  2012-02-09
  • Inventors:  Jones, David; Pschenitzka, Florian; Wolk, Jeffrey; Quan, Xina; Spaid, Michael A.
    • Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive ...
    ]]>     20120033367     <![CDATA[ELECTRIC CONNECTION OF CONDUCTOR ENDS ARRANGED IN PAIRS AND METHOD FOR ESTABLISHING THE CONNECTION]]> http://www.patentstorm.us/applications/20120032550/description.html
  • Application Number:  20120032550
  • Publication Date:  2012-02-09
  • Inventor:  Wolf, Gert
    • The invention relates to the electric connection of conductor ends (26b), which are arranged in pairs and are positioned on top of each other, of a winding comprising individual conductors and to a method for establishing the connection, wherein a plurality of the conductor ends in pairs are arranged next to each other at a distance (a). In order to establish the electric connection with the briefest and most spatially delimited heating possible, it is proposed to insert a ...
    ]]>     20120032550     <![CDATA[Flip Chip Substrate Package Assembly and Process for Making Same]]> http://www.patentstorm.us/applications/20120032337/description.html
  • Application Number:  20120032337
  • Publication Date:  2012-02-09
  • Inventors:  Liu, Chung-Shi; Lu, Chen-Fa; Yu, Chen-Hua
    • Apparatus and methods for providing a package substrate and assembly for a flip chip integrated circuit. A substrate is provided having a solder mask layer, openings in the solder mask layer for conductive bump pads, and openings in the solder mask layer between the conductive bump pads exposing a dielectric layer underneath the solder mask layer. A flip chip integrated circuit is attached to the substrate using a thermal reflow to reflow conductive solder bumps on the integrated circuit to the ...
    ]]>     20120032337     <![CDATA[PRESS-CONTACT CONNECTION APPARATUS AND ILLUMINATION APPARATUS]]> http://www.patentstorm.us/applications/20120031668/description.html
  • Application Number:  20120031668
  • Publication Date:  2012-02-09
  • Inventor:  TAKASAKI, Tetsuro
    • There is provided a press-contact connection apparatus, including: a base part; press-contact terminals which are fixed to the base part; and an electric wire holder which holds a plurality of electric wires to be press-contacted with the respective press-contact terminals. The base part includes a support which supports the electric wire holder rotatably and serves as a fulcrum of a rotation of the electric wire. The electric wire holder includes a rotational shaft which is provided in one end ...
    ]]>     20120031668     <![CDATA[ELECTRONIC DEVICE HOUSING]]> http://www.patentstorm.us/applications/20120031667/description.html
  • Application Number:  20120031667
  • Publication Date:  2012-02-09
  • Inventor:  DAI, BIN
    • An electronic device housing includes a first housing, a second housing, a plurality of frames, and a plurality of fixing members. The first housing includes a bottom plate and a side plate extending from an edge of the bottom plate. The side plate is welded to the second housing. The frames are welded to the first housing. The fixing members fix the second housing to the ...
    ]]>     20120031667     <![CDATA[ELECTRONIC DEVICE HOUSING]]> http://www.patentstorm.us/applications/20120031666/description.html
  • Application Number:  20120031666
  • Publication Date:  2012-02-09
  • Inventor:  DAI, BIN
    • An electronic device housing includes a first housing, a second housing, and a plurality of frames. The first housing comprises a bottom plate and a side plate extending from an edge of the bottom plate. The side plate of the first housing is welded to the second housing. The frames are fixed to the first housing. Each frame forms a restricting portion connecting the second ...
    ]]>     20120031666     <![CDATA[ELECTRONIC DEVICE HOUSING]]> http://www.patentstorm.us/applications/20120031665/description.html
  • Application Number:  20120031665
  • Publication Date:  2012-02-09
  • Inventors:  SHI, FA-GUANG; DAI, BIN
    • An electronic device housing includes a first housing and a second housing. The first housing forms a welding portion. The second housing defines a receiving groove in the periphery for receiving the welding portion. The welding portion is welded to an inner wall of the receiving groove of the second ...
    ]]>     20120031665     <![CDATA[WINDOW COMPATIBLE ELECTRICAL POWER DEVICE]]> http://www.patentstorm.us/applications/20120031664/description.html
  • Application Number:  20120031664
  • Publication Date:  2012-02-09
  • Inventor:  Nixon-Lane, Karen
    • A device that supplies electrical current to various outdoor locations via through-hole areas of building structures, such as window frames, door openings, etc. which includes a flatten portion with a male electrical outlet plug coupled to one end and one or more female electrical outlet(s) coupled to the other end. The male electrical outlet plug and/or the one or more female electrical outlet(s) can be coupled to the flattened portion by an electrical cord. The flattened portion includes two ...
    ]]>     20120031664     <![CDATA[HELICAL FINE STRUCTURE, METHOD FOR PRODUCING THE SAME, AND ELECTRIC-WAVE SHIELD OR ABSORBER USING THE HELICAL FINE STRUCTURE]]> http://www.patentstorm.us/applications/20120031663/description.html
  • Application Number:  20120031663
  • Publication Date:  2012-02-09
  • Inventors:  Iyoda, Tomokazu; Yamada, Atsushi; Ito, Kaori
    • A helical fine structure of the present invention is characterized by including: a phytoplankton having a helical shape and selected from a group of cyanobacteria called Spirulina; and a surface modification layer formed on the phytoplankton. The surface modification layer includes at least one metal plating layer. Thereby, the helical fine structure can be utilized as an electric-wave shield or an absorber. Moreover, a method for producing the helical fine structure is characterized in ...
    ]]>     20120031663     <![CDATA[SENSOR MODULE HAVING AN ELECTROMAGNETICALLY SHIELDED ELECTRICAL COMPONENT]]> http://www.patentstorm.us/applications/20120031662/description.html
  • Application Number:  20120031662
  • Publication Date:  2012-02-09
  • Inventors:  Kunert, Peter; Hortig, Michael
    • In a module having an electrical component, which is situated between two ground planes for electromagnetic shielding, a trough-shaped composite component is provided between an inner and an outer housing, into which the rear side of the inner housing is inserted, the composite component having an insulator trough and, on its inside, a ground plane formed at least on the trough bottom, which forms the shielding of a rear side of the electrical component. The composite component is ...
    ]]>     20120031662     <![CDATA[ELECTROMAGNETIC SHIELDING DEVICE]]> http://www.patentstorm.us/applications/20120031661/description.html
  • Application Number:  20120031661
  • Publication Date:  2012-02-09
  • Inventors:  CHEN, KUAN-HUNG; WANG, YAO; TAN, ZHENG-PING
    • A shielding device includes a frame, a shielding enclosure and a shaft. The frame includes sidewalls and at least one hinged portion. The shielding enclosure includes a cover and flanges extending therefrom for engagement with the sidewalls of the frame. A barrel portion is formed on the shielding enclosure and is aligned with the hinged portion. The shaft extends through the hinged portion and the barrel portion for rotatably connecting the shielding enclosure to the ...
    ]]>     20120031661