U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Image capturing unit for electronic endoscope

Patent 7628752 Issued on December 8, 2009. Estimated Expiration Date: Icon_subject July 10, 2026. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Lens retaining device
Patent #: 4725126
Issued on: 02/16/1988
Inventor: Siga ,   et al.

Endoscope using a chip carrier type solid state imaging device
Patent #: 4745470
Issued on: 05/17/1988
Inventor: Yabe ,   et al.

Device for retaining an optical part
Patent #: 4778253
Issued on: 10/18/1988
Inventor: Siga ,   et al.

Endoscope having optical elements that are resistant to condensation
Patent #: 4805598
Issued on: 02/21/1989
Inventor: Ueda

Endoscope with an optical system
Patent #: 4841952
Issued on: 06/27/1989
Inventor: Sato ,   et al.

Solid state imaging device having a chambered imaging chip corner
Patent #: 5291010
Issued on: 03/01/1994
Inventor: Tsuji

Imaging device for digital photography
Patent #: 6564018
Issued on: 05/13/2003
Inventor: Melman, et al.

Lens assembly for endoscopic lens system
Patent #: 6695775
Issued on: 02/24/2004
Inventor: Watanabe ,   et al.

Capsule endoscope
Patent #: 7022066
Issued on: 04/04/2006
Inventor: Yokoi, et al.

Imaging element, imaging device, camera module and camera system
Patent #: 7375757
Issued on: 05/20/2008
Inventor: Hoshino, et al.

More ...

Inventors

Assignee

Application

No. 11456281 filed on 07/10/2006

US Classes:

600/109With camera or solid state imager

Examiners

Primary: Leubecker, John P

Attorney, Agent or Firm

Foreign Patent References

  • 7-226493 JP 08/01/1995
  • 2000-060793 JP 02/01/2000
  • 2003-100920 JP 04/01/2003
  • 2003-258221 JP 09/01/2003

International Classes

A61B 1/05
A61B 1/04

Abstract

An image capturing unit for an electronic endoscope is provided with a solid-state image capturing element having multiple boding wires arranged at peripheral positions on a front surface of the solid-state image capturing element, the bonding wires extending outward, an image capturing element holding frame in which the solid-state image capturing element is held and a transparent cover glass enclosing the front surface of the solid-state image capturing element from outside, together with a tip end portion of the image capturing element holding frame. The tip end portion of the image capturing element holding frame is formed to have a tubular section, the cover glass being fitted in the tubular section and located at a position where the cover glass does not contact the bonding wires, the cover glass being air-tightly cemented to the tubular section.

Other References

  • U.S. Appl. No. 11/456,288 to Yamamoto et al., which was filed on Jul. 10, 2006.
  • U.S. Appl. No. 11/456,253 to Yamamoto et al., which was filed on Jul. 10, 2006.
  • U.S. Appl. No. 11/427,812 to Ogino et al., which was filed on Jun. 30, 2006.
  • English language Abstract of JP 7-226493.
  • English language Abstract of JP 2003-100920.
  • English language Abstract of JP 2003-258221.
  • English language Abstract of JP 2000-060793.
PatentsPlus Images
Enhanced PDF formats
loading...
PatentsPlus: add to cart
PatentsPlus: add to cartSearch-enhanced full patent PDF image
$9.95more info
PatentsPlus: add to cart
PatentsPlus: add to cartIntelligent turbocharged patent PDFs with marked up images
$18.95more info
 
Sign InRegister
Username  
Password   
forgot password?