Power semiconductor module with capacitors connected parallel to one another
Patent 7613008 Issued on November 3, 2009. Estimated Expiration Date: 
November 22, 2026. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
November 22, 2026. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesElectrical connection box, a connection construction, a busbar fixing construction and a connection terminal Electronic power device and electronic power assembly comprising such a device Patent #: 6249448 InventorsAssigneeApplicationNo. 11603606 filed on 11/22/2006US Classes:361/775BusbarExaminersPrimary: Dinh, Tuan TAttorney, Agent or FirmInternational ClassH01R 9/00AbstractA power semiconductor module is presented. The power semiconductor module includes a plurality of capacitors coupled in parallel with each other. Each of the plurality of capacitors each includes a first and a second connection element. The power semiconductor module further includes a first and a second busbar. The first connection element of each of the plurality of capacitors is bonded to the first busbar, and the second connection element of each of the plurality of capacitors is bonded to the second busbar. The power semiconductor module further includes an insulating element disposed between the first busbar and the second busbar, and a pressure assembly that includes at least one pressure body and one associated counterpart pressure body. The first connection element and the second connection element of each of the plurality of capacitors is subjected to pressure and electrically bonded to the associated busbars by the pressure assembly.Field of SearchCapacitor and electrical componentIntegrated circuit By direct coating of components on board Capacitor and resistor Busbar Contact banks Terminal block With protective device or unit Support brackets Wire distribution (e.g., harness, rack, etc.) With interconnecting cable With switchboard or switch Frame With plurality of capacitors Change of physical state With heat exchanger unit With cold plate or heat sink With cooling fins Thermal conduction By specific coating Containing silicon or aluminum Through support means Specific chemical compound or element Heat sink Details With contact or lead Having power distribution means (e.g., bus structure) With particular lead geometry Within distinct housing spaced from panel circuit arrangement Automotive junction box | |
