Thermoelastic device with preselected resistivity, inertness and deposition characteristics
June 26, 2027. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesIntegrated thermal ink jet printhead and method of manufacture Metalization systems for heater/sensor elements Electric contact materials, production methods thereof and electric contacts used these Multi-dimensional physical actuation of microstructures Ti/titanium nitride and ti/tungsten nitride thin film resistors for thermal ink jet technology Micro-electromechanical (MEM) optical resonator and method Integrated released beam, thermo-mechanical sensor for sensing temperature variations and associated methods Microelectro-mechanical system actuator device and reconfigurable circuits utilizing same Latching microaccelerometer Method of processing ceramic materials and a microwave furnace therefore InventorsAssigneeApplicationNo. 11768875 filed on 06/26/2007US Classes:374/44Thermal conductivityExaminersPrimary: Turner, ArcheneForeign Patent References
International ClassB32B 9/00AbstractA thermoelastic device comprising an expansive element is disclosed. The expansive element is formed from a material, which is preselected on the basis that it has one or more of the following properties: a resistivity between 0.1 μΩm and 10.0 μΩm; chemically inert in air; chemically inert in the chosen ink; and depositable by CVD, sputtering or other thin film deposition technique.Other References
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