Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
February 7, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSurface-mountable opto-component Overpressure-protected, polysilicon, capacitive differential pressure sensor and method of making the same Method of making and sealing a semiconductor device having an air path therethrough Sample measuring device and sample measuring system Method of making a cover for an integrated optical circuit, cover for an integrated optical circuit, and integrated optical circuit made with this cover Detector cell Semiconductor pressure sensor with spacing member disposed between sensor and substrate Micromachined capillary electrophoresis device Miniaturized circulatory measuring chamber with integrated chemo- and/or biosensor elements Semiconductor sensor with protective cap covering exposed conductive through-holes InventorsAssigneeApplicationNo. 10504738 filed on 02/07/2003US Classes:438/49Chemically responsiveExaminersPrimary: Zarneke, David AAttorney, Agent or FirmForeign Patent References
International ClassH01L 21/00AbstractIn a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an interface between the sensor and the environment. An adhesive layer is provided between the chip and the protective cover, the adhesive layer alone or together with the protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor. In an alternative embodiment, the protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers. The channel leading from one side of the arrangement to the sensor may be taken through the adhesive layer, through the protective cover, or through both. A hole may be formed in the protective cover above the sensor, with the sensor lying loosely in the hole. The reaction volume may be determined by the dimensions of the hole.Other References
Field of SearchChemically responsivePackaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor Having additional optical element (e.g., optical fiber, etc.) Acoustic wave Strain sensors With housing or encapsulation Encapsulation (EPO) Coatings (EPO) | |
