Embedded circuits on an ultrasound transducer and method of manufacture
July 10, 2027. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesUltrasonic transducer and method for fabricating thereof Ultrasonic probe and method of manufacturing the same Signal conditioning and interconnection for an acoustic transducer High density interconnect for an ultrasonic phased array and method for making Phased array acoustic systems with intra-group processors Method of making an acoustic probe Composite transducer with connective backing block Phased array acoustic systems with intra-group processors Flexible substrate transducer assembly Patent #: 6324907 InventorsAssigneeApplicationNo. 11827179 filed on 07/10/2007US Classes:310/334Acoustic wave type generator or receiverExaminersPrimary: Leung, QuyenAssistant: Gordon, Bryan P International ClassH04R 17/00AbstractOne or more chips, integrated circuits, or semiconductors are embedded within a backing block. Planar sheets of backing material are formed with integrated circuits within holes in the sheets. Traces connect the integrated circuit to electrodes or exposed conductive surfaces. A plurality of the planar sheets may be manufactured using wafer processing, such as pick and place of chips in a wafer of backing material and IC redistribution for forming the traces. The different sheets are cut from the wafer and stacked adjacent each other. The transducer connects with the exposed electrodes or conductive surfaces of the backing. | |
