Electronic control enclosure

Patent 7542294 Issued on June 2, 2009. Estimated Expiration Date:

March 12, 2027. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

3542381

3818419

3854247

Compact electronic control and power unit structure
Patent #: 4047242
Issued on: 09/06/1977
Inventor: Jakob , et al.

Cooling apparatus for electronic modules
Patent #: 4298905
Issued on: 11/03/1981
Inventor: Bosler , et al.

Cooling element for solder bonded semiconductor devices
Patent #: 4442450
Issued on: 04/10/1984
Inventor: Lipschutz , et al.

Device for cooling a plurality of integrated modules combined on a rigid printed circuitboard to form logic cards
Patent #: 4521829
Issued on: 06/04/1985
Inventor: Wessely

Heat exchanging electronic module housing
Patent #: 4546407
Issued on: 10/08/1985
Inventor: Benenati

Combined housing and heat sink for electronic engine control system components
Patent #: 4557225
Issued on: 12/10/1985
Inventor: Sagues , et al.

Multiple fastening clip and device for the collective mounting of electronic power components
Patent #: 4674005
Issued on: 06/16/1987
Inventor: Lacz

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Inventors

Assignee

Cinch Connectors, Inc.

Application

No. 11716915 filed on 03/12/2007

US Classes:

361/704Thermal conduction

Examiners

Primary: Chervinsky, Boris L

Attorney, Agent or Firm

Leydig, Voit & Mayer, LTD.

Foreign Patent References

3440334 DE 05/01/1986
43 44 629 DE 07/01/1994
198 03 358 DE 08/01/1999
0 400 434 EP 05/01/1990
1 006 766 EP 11/01/1999
2741503 FR 05/01/1997
2831384 FR 04/01/2003
62-252157 JP 11/01/1987
WO 91/11897 WO 08/01/1991

International Class

H05K 7/20

Abstract

The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

Other References

U.S. Appl. No. 11/716,964, filed Mar. 12, 2007, Caines et al.
U.S. Appl. No. 11/706,908, filed Feb. 13, 2007, Caines et al.
Pages from www.surepower.com of Low Voltage Disconnect and Daytime Running Light Control, Sure Power Industries, Inc., © 2005.
Photographs of enclosure by Sure Power, available approximately Sep. 2003.