Viscoelastic polisher and polishing method using the same
July 9, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2819568 Composite polishing pad for semiconductor process Method and apparatus for uniform polishing of a substrate Polishing machine and method of dissipating heat therefrom CMP platen with patterned surface Eliminating air pockets under a polished pad Fixed abrasive article for use in modifying a semiconductor wafer Through-pad drainage of slurry during chemical mechanical polishing Profile control platen Chemical mechanical polishing system InventorsAssigneeApplicationNo. 10557018 filed on 07/09/2004US Classes:451/36Utilizing fluent abradantExaminersPrimary: Eley, Timothy VAttorney, Agent or FirmForeign Patent References
International ClassesB24B 1/00B24D 11/00 AbstractA viscoelastic polisher to be used for polishing. The viscoelastic polisher includes a viscoelastic layer provided on a major surface of a base disk and having a hole of a predetermined radius formed in a center portion thereof, and the base disk has a plurality of grooves equiangularly provided in the major surface thereof as extending radially outward from a center portion thereof. This arrangement ensures stable supply of an abrasive liquid, and obviates a need for formation of grooves in the viscoelastic layer.Field of SearchUtilizing fluent abradantGlass or stone abrading Utilizing nonrigid tool Side face of disk Rotary work holder By means loosely confining work Planar surface abrading Having pressure plate Disk or wheel abrader TOOL SUPPORT FOR FLEXIBLE-MEMBER TOOL Work face variegated or on projecting backing Laminate Disk laps | |
