Semiconductor device and a memory system including a plurality of IC chips in a common package
Low power multi-chip semiconductor memory device and chip enable method thereof Patent #: 7379380
ApplicationNo. 11812840 filed on 06/22/2007
US Classes:365/52HARDWARE FOR STORAGE ELEMENTS
ExaminersPrimary: Phan, Trong
Attorney, Agent or Firm
International ClassesG11C 5/00
AbstractA semiconductor package for forming a Double Die Package (DDP) with a plurality of single chips includes: a buffer configured to buffer an external address to generate a row address which is defined only in a DDP mode; a column address control unit configured to replace the row address with a column address, which is defined only in the DDP mode, in a single chip mode; and a read operation control unit configured to output a bank read signal latched in an active bank in a read mode of the DDP, and to selectively activate a first address control signal and a second address control signal for activating a bank selected from the single chip or the DDP in response to the bank read signal.