U.S. patents available from 1976 to present.
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Equivalent gate count yield estimation for integrated circuit devices

Patent 7477961 Issued on January 13, 2009. Estimated Expiration Date: Icon_subject May 12, 2026. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Method and system for determining critical area for circuit layouts using voronoi diagrams
Patent #: 6178539
Issued on: 01/23/2001
Inventor: Papadopoulou, et al.

Methods and systems for predicting IC chip yield
Patent #: 6751519
Issued on: 06/15/2004
Inventor: Satya, et al.

System and method for generating a two-dimensional yield map for a full layout
Patent #: 6996790
Issued on: 02/07/2006
Inventor: Chang

Method for modeling integrated circuit yield
Patent #: 7013441
Issued on: 03/14/2006
Inventor: Bickford, et al.

Simplified process to design integrated circuits Patent #: 7055113
Issued on: 05/30/2006
Inventor: Broberg, III, et al.

Inventors

Assignee

Application

No. 11382963 filed on 05/12/2006

US Classes:

700/121Integrated circuit production or semiconductor fabrication

Examiners

Primary: Jarrett, Ryan A.
Assistant: Rapp, Chad

Attorney, Agent or Firm

International Class

G06F 19/00

Abstract

A method of modeling yield for semiconductor products includes determining expected faults for each of a plurality of library elements by running a critical area analysis on each of the library elements, and assessing, from the critical area analysis, an expected number of faults per unit area, and comparing the same to actual observed faults on previously manufactured semiconductor products. Thereafter, the expected number of faults for each library element is updated in response to observed yield. A database is established, which includes the die size and expected faults for each of the library elements. Integrated circuit product die size is estimated, and library elements to be used to create the integrated circuit die are selected. Fault and size data for each of the selected library elements are obtained, the adjusted estimated faults for each of the library elements are summed, and estimated yield is calculated.

Other References

  • Fred J. Meyer et al.; “Predicting Defect-Tolerant Yield in the Embedded Core Context;” IEEE Transactions on Computers, vol. 52, No. 11, Nov. 2003; pp. 1470-1479.
  • Albert V. Ferris-Prabhu, “On the Assumptions Contained in Semiconductor Yield Models”, IEEE Transactions on Computer-Aided Design, vol. 11, No. 8, Aug. 1992, p. 966-975.
  • Reinhard Marz, et al, “Yield and Cost Model for Integrated Optical Chips”, Journal of Lightwave Technology, vol. 14, No. 2, Feb. 1996, p. 158-163.
  • Charles H. Stapper, “The Defect-Sensitivity Effect of Memory Chips”, IEEE Journal of Solid-State Circuits, vol. SC-21, No. 1, Feb. 1986, p. 193-198.
  • S.-K. Lu, et al, “Modelling economies of DFT and DFY: a profit perspective”, IEE Proc.-Comput. Digit. Tech., vol. 151, No. 2, Mar. 2004, p. 119-126.
  • Charles H. Stapper, et al, “Integrated Circuit Yield Statistics”, Proceedings of the IEEE, vol. 71, No. 4, Apr. 1983, p. 453-470.
  • Steven M. Domer, et al, “Model for Yield and Manufacturing Prediction on VLSI Designs for Advanced Technologies, Mixed Circuitry, and Memories”, IEEE Journal of Solid-State Circuits, vol. 30, No. 3, Mar. 1995, p. 286-294.
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