Patent ReferencesMethod and system for determining critical area for circuit layouts using voronoi diagrams Methods and systems for predicting IC chip yield System and method for generating a two-dimensional yield map for a full layout Method for modeling integrated circuit yield Simplified process to design integrated circuits Patent #: 7055113 Inventors
AssigneeApplicationNo. 11382963 filed on 05/12/2006US Classes:700/121Integrated circuit production or semiconductor fabricationExaminersPrimary: Jarrett, Ryan A.Assistant: Rapp, Chad Attorney, Agent or FirmInternational ClassG06F 19/00AbstractA method of modeling yield for semiconductor products includes determining expected faults for each of a plurality of library elements by running a critical area analysis on each of the library elements, and assessing, from the critical area analysis, an expected number of faults per unit area, and comparing the same to actual observed faults on previously manufactured semiconductor products. Thereafter, the expected number of faults for each library element is updated in response to observed yield. A database is established, which includes the die size and expected faults for each of the library elements. Integrated circuit product die size is estimated, and library elements to be used to create the integrated circuit die are selected. Fault and size data for each of the selected library elements are obtained, the adjusted estimated faults for each of the library elements are summed, and estimated yield is calculated.Other References
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