Method of producing a MEMS device
Patent 7416984 Issued on August 26, 2008. Estimated Expiration Date: 
August 9, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 9, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod for separating circuit dies from a wafer Apparatus and method for multi-axis capacitive sensing Micromachined gyros Patent #: 6505511 InventorsAssigneeApplicationNo. 10914576 filed on 08/09/2004US Classes:438/691, Combined mechanical and chemical material removal438/692, Simultaneous (e.g., chemical-mechanical polishing, etc.)438/702, Plural coating steps438/745, Liquid phase etching216/52, MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE216/99Substrate contains silicon or silicon compoundExaminersPrimary: Tran, Binh X.Attorney, Agent or FirmForeign Patent References
International ClassH01L 21/302AbstractA method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.Other References
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