Method for separating circuit dies from a wafer
Apparatus and method for multi-axis capacitive sensing
Micromachined gyros Patent #: 6505511
ApplicationNo. 10914576 filed on 08/09/2004
US Classes:438/691, Combined mechanical and chemical material removal438/692, Simultaneous (e.g., chemical-mechanical polishing, etc.)438/702, Plural coating steps438/745, Liquid phase etching216/52, MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE216/99Substrate contains silicon or silicon compound
ExaminersPrimary: Tran, Binh X.
Attorney, Agent or Firm
Foreign Patent References
International ClassH01L 21/302
AbstractA method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.