U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Liquid submersion cooling system

Patent 7403392 Issued on July 22, 2008. Estimated Expiration Date: Icon_subject April 18, 2027. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3812402

Electronic cooling
Patent #: 4302793
Issued on: 11/24/1981
Inventor: Rohner

Immersion cooled high density electronic assembly
Patent #: 4590538
Issued on: 05/20/1986
Inventor: Cray, Jr.

Immersion cooled circuit module with improved fins
Patent #: 4765397
Issued on: 08/23/1988
Inventor: Chrysler ,   et al.

Liquid cooled high density packaging for high speed circuits
Patent #: 4847731
Issued on: 07/11/1989
Inventor: Smolley

Semiconductor cooling device
Patent #: 5021924
Issued on: 06/04/1991
Inventor: Kieda, et al.

Gas-liquid forced turbulence cooling
Patent #: 5131233
Issued on: 07/21/1992
Inventor: Cray, et al.

Cooling of semiconductor power modules by flushing with dielectric liquid
Patent #: 5448108
Issued on: 09/05/1995
Inventor: Quon, et al.

Liquid coolant circulation control system for immersion cooling
Patent #: 5458185
Issued on: 10/17/1995
Inventor: Mizuno

Cooling apparatus using boiling and condensing refrigerant
Patent #: 5613552
Issued on: 03/25/1997
Inventor: Osakabe, et al.

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Inventors

Assignee

Application

No. 11736947 filed on 04/18/2007

US Classes:

361/699, Liquid361/687, With cooling means361/696, With heat exchanger unit361/698, And liquid361/701, With heat exchanger unit165/80.4, Liquid cooled165/104.33Cooling electrical device

Examiners

Primary: Gandhi, Jayprakash N.
Assistant: Hoffberg, Robert J.

Attorney, Agent or Firm

Foreign Patent References

  • 10-213370 JP 11/01/1998
  • 18-057920 JP 02/01/2006

International Classes

H05K 7/20
F28D 7/00

Abstract

A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.

Other References

  • PCT Written Opinion of the International Searching Authority for corresponding International Application No. PCT/US2007/068849 mailed Oct. 24, 2007.
  • PCT International Search Report for corresponding International Application No. PCT/US2007/068849 mailed Oct. 24, 2007.
  • Specification for co-pending U.S. Appl. No. 11/736,985, filed Apr. 18, 2007.
  • Specification for co-pending U.S. Appl. No. 11/736,965, filed Apr. 18, 2007.
  • Article printed from http://www.pugetsystems.com/submerged.php, “Mineral Oil Submerged Computer”, Aug. 1, 2007, pp. 1-7.
  • http://www.pugetsystems.com/ “Puget Custom Computer—Desktop Computers, Laptops, Servers”, Aug. 21, 2007, 1 page.
  • Article printed from http://www.tomshardware.com/2006/01/09/stripoutthefans/, “Strip Out The Fans, Add 8 Gallons of Cooking Oil / Tom's Hardware”, Aug. 1, 2007, pp. 1-30.
  • http://www.tomshardware.com, “Tom's Hardware—Computer Hardware News, Tests, Ratings and Reviews”, Aug. 21, 2007, pp. 1-2.
  • “Koolance 1200W Liquid-Cooled Power Supply”, article printed from http://www.koolance.com/shop/productinfo.php?cPath=2873&productsid=387, Apr. 3, 2007, pp. 1-3.
  • Diagrams printed from http://www.koolance.com/shop/diagrams/more/psu-1200atx-12s, Apr. 3, 2007, pp. 1-4.
  • Images printed from http://www.koolance.com/shop/images/more/psu-1200atx-12s, Apr. 3, 2007, pp. 1-3.
  • “Koolance Superior Liquid Cooling Systems”, PSU-1200ATX-12S User Manual, English v1.01, pp. 1-10.
  • Article printed from http://www.pugetsystems.com/submerged.php, “Minerial Oil Submerged Computer” (Clearer copy of article reference on applicant's IDS of Aug. 22, 2007).
  • Article printed from http://www.tomshardware.com/2006/01/09/stripoutthefans/, “Strip Out the Fans, Add 8 Gallons of Cooking Oil” (Clearer copy of article referenced on applicant's IDS of Aug. 22, 2007).
  • Anderson et al., “Subcooled Flow Boiling Scheme for Direct Immersion Cooling of Three-Dimensional Electronic Packages in a Large-Scale Computers or Supercomputers”, IBM Technical Bulletin, No. 11, Apr. 1991, pp. 387-390.
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