Methods and apparatuses for thermal dissipation

Patent 7388753 Issued on June 17, 2008. Estimated Expiration Date:

April 12, 2026. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Circuit assemblies each with a component cooperating with a connector and clamp to a substrate
Patent #: 4369485
Issued on: 01/18/1983
Inventor: Bell , et al.

Automatic fan speed control
Patent #: 5249741
Issued on: 10/05/1993
Inventor: Bistline, et al.

Circuit card assembly
Patent #: 5353192
Issued on: 10/04/1994
Inventor: Nordin

Method and apparatus for transferring heat from a PCMCIA card
Patent #: 5808869
Issued on: 09/15/1998
Inventor: Donahoe, et al.

PC card for cooling a portable computer
Patent #: 5862037
Issued on: 01/19/1999
Inventor: Behl

Conductive bonding design for metal backed circuits
Patent #: 5920037
Issued on: 07/06/1999
Inventor: Jimarez, et al.

Shielded radio card assembly
Patent #: 6104620
Issued on: 08/15/2000
Inventor: Dudas, et al.

Connector and connecting structure using connector Patent #: 6111751
Issued on: 08/29/2000
Inventor: Sakuyama

Inventors

Assignee

Sierra Wireless, Inc.

Application

No. 11403562 filed on 04/12/2006

US Classes:

361/720, For printed circuit board361/704, Thermal conduction361/715, For module361/722, For electronic circuit174/16.3, With heat sink174/252, With cooling means165/80.3, Air cooled, including fins165/104.33, Cooling electrical device165/185HEAT TRANSMITTER

Examiners

Primary: Dalskovsky, Michael

Attorney, Agent or Firm

Thelen Reid Brown Raysman & Steiner LLP

International Classes

H05K 7/20
H01L 23/36

Abstract

A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.