Imaging element, imaging device, camera module and camera system
August 31, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesElectronic endoscope with a mask bump bonded to an image pick-up device Compact recording apparatus with functional components mounted on a substrate Compact imaging apparatus for electronic endoscope with improved optical characteristics Electronic imaging module for reversibly converting a photographic camera into an electronic imaging camera Image device having a spacer with image arrays disposed in holes thereof Imaging apparatus Imager package substrate Optical apparatus Small reliable image input apparatus incorporated in finger-print collation system of personal identification Image pickup apparatus fabrication method thereof image pickup adaptor apparatus signal processing apparatus signal processing method thereof information processing apparatus and information processing method InventorsAssigneeApplicationNo. 09652150 filed on 08/31/2000US Classes:348/340, With optics peculiar to solid-state sensor348/374For internal camera componentsExaminersPrimary: Ye, LinAssistant: Hernandez, Nelson D. Attorney, Agent or FirmForeign Patent References
International ClassH04N 5/225AbstractThe system and apparatus of the present invention are directed to a camera module in which an operational defect (generation of a ghost image) as a result of a reduction in thickness is eliminated. The camera module includes a substrate provided with a through-hole for light transmission, a light receiving portion provided on a first surface of an imaging element. The imaging element is flip chip mounted on a first side of the substrate such that the light receiving portion is exposed through the through-hole, and a shielding layer on a back surface of the imaging element wherein the back surface is opposite the first surface having the light receiving portion. A lens unit is mounted a second side of the substrate.Other References
Field of SearchPlural photosensitive image detecting element arraysOptics Support or housing For internal camera components For specified accessory With optics peculiar to solid-state sensor Solid-state image sensor Focus control With object or scene illumination Flash or strobe Combined image signal generator and general image signal processing Combined automatic gain control and exposure control (i.e., sensitivity control) Simulator With endoscope Combined with diverse art tool, instrument or machine With lens casing Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package) Outside periphery of package having specified shape or configuration With semiconductor element forming part (e.g., base, of housing) Pressed against semiconductor element Entirely of metal except for feedthrough With specified insulator to isolate device from housing With raised portion of base for mounting semiconductor chip Metallic housing or support | |
