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Issued on: 09/20/1994
Inventor: Ohsawa, et al.

Semiconductor package
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Issued on: 03/21/2000
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High performance flip chip package
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Issued on: 10/17/2000
Inventor: Joshi

6369441

Power semiconductor package and method for making the same
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Issued on: 10/15/2002
Inventor: Kuo

High performance multi-chip flip chip package
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Issued on: 12/03/2002
Inventor: Joshi

Array waveguide grating and method of manufacture thereof
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Stacked intelligent power module package
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Lead frame, semiconductor device and manufacturing method thereof, circuit board and electronic equipment
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Issued on: 08/19/2003
Inventor: Sone

Thin, small-sized power semiconductor package
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Issued on: 09/16/2003
Inventor: Choi ,   et al.

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High performance multi-chip flip package
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Issued on: 09/30/2003
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High performance multi-chip flip chip package
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Wafer-level coated copper stud bumps
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Unmolded package for a semiconductor device
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Semiconductor power package module
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Semiconductor die package including drain clip
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Multichip module including substrate with an array of interconnect structures
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Semiconductor die package with semiconductor die having side electrical connection
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Structure of integrated trace of chip package
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Lead frame structure with aperture or groove for flip chip in a leaded molded package
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Semiconductor die package processable at the wafer level
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Semiconductor device with protrusions
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Thin, thermally enhanced flip chip in a leaded molded package
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Carrier with metal bumps for semiconductor die packages
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Multi-part lead frame with dissimilar materials and method of manufacturing
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Method for maintaining solder thickness in flipchip attach packaging processes
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High performance multi-chip flip chip package
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Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package Patent #: 7224045
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