Apparatus for cleaning a substrate on which a resist pattern is formed
Substrate processing apparatus
Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
Method and device of forming a film using a coating material and method of manufacturing a semiconductor device
Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzle Patent #: 7018481
ApplicationNo. 11111141 filed on 04/20/2005
US Classes:396/611, Plate or wafer-type photographic medium430/311, Making electrical device438/782, With substrate handling during coating (e.g., immersion, spinning, etc.)134/2For metallic, siliceous, or calcareous basework, including chemical bleaching, oxidation or reduction
ExaminersPrimary: Rutledge, D.
Attorney, Agent or Firm
Foreign Patent References
International ClassG03D 5/00
AbstractAn apparatus (3) for removing developing solution from a substrate (30) includes a working table (36) for placing the substrate, a supporting frame (33) positioned on the working table, a gas dispensing nozzle (31) mounted on the supporting frame, and a water dispensing nozzle (32) mounted on the supporting frame. The apparatus can remove the residual developing solution from the substrate and needs not to lift the substrate. The substrate is safely processed and the working time is improved.
Field of SearchPlate or wafer-type photographic medium