System, method, and medium for monitoring performance of an advanced process control system
Patent 7356377 Issued on April 8, 2008.
Estimated Expiration Date: January 29, 2024.
Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
700/108, Performance monitoring700/31, Having adjustment of model (e.g., update)700/121, Integrated circuit production or semiconductor fabrication73/865.8, INSPECTING702/81, Quality evaluation702/84, Quality control700/99, Resource allocation700/275Mechanical control system
A method for monitoring performance of an advanced process control system for at least one process output includes calculating a variance of a prediction error for a processing performance and/or a probability for violating specification limits of the processing performance of the at least one process output. If the variance of the prediction error is calculated, the method also includes calculating a model health index. If the probability for violating specification limits is calculated, the method further includes calculating a process health index.
Other References
Nov. 17, 2004. Written Opinion for PCT Serial No. PCT/US01/27407.
Oct. 12, 2004. International Preliminary Examination Report for PCT Serial No. PCT/US02/19061.
Oct. 6, 2004. Office Action for U.S. Appl. No. 10/759,108, filed Jan 20, 2004.
Oct. 1, 2004. International Preliminary Examination Report for PCT Serial No. PCT/US03/23964.
Sep. 29, 2004. Office Action for U.S. Appl. No. 09/363,966, filed Jul. 29, 1999.
Sep. 15, 2004. Office Action for U.S. Appl. No. 10/632,107, filed Aug. 1, 2003.
Sep. 16, 2004. International Preliminary Examination Report for PCT Serial No. PCT/US02/24859.
Sep. 9, 2004. Written Opinion for PCT Serial No. PCT/US02/21942.
Aug. 25, 2004. Office Action for U.S. Appl. No. 09/998,384, filed Nov. 30, 2001.
Aug. 24, 2004. Office Action for U.S. Appl. No. 10/135,405, filed May 1, 2002.
Aug. 18, 2004. International Preliminary Examination Report for PCT/US02/19116.
Aug. 9, 2004. Written Opinion for PCT Serial No. PCT/US02/19063.
Aug. 2, 2004. Office Action for U.S. Appl. No. 10/174,377, filed Jun. 18, 2002.
Jul. 15, 2004. Office Action for U.S. Appl. No. 10/172,977, filed Jun. 18, 2002.
Lantz, Mikkel. 1999. “Equipment and APC Integration at AMD with Workstream.” IEEE, pp. 325-327.
Guo, R.S, A. Chen, C.L. Tseng, I.K. Fong, A. Yang, C.L. Lee, C.H. Wu, S. Lin, S.J. Huang, Y.C. Lee, S.G. Chang and M.Y. Lee. Jun. 16-17, 1998. “A Real-Time Equipment Monitoring and Fault Detection System.” Semiconductor Manufacturing Technology Workshop, pp. 111-121.
Kim, Eui Jung and William N. Gill. Jul. 1994. “Analytical Model for Chemical Vapor Deposition of SiO2 Films Using Tetraethoxysliane and Ozone” (Abstract). Journal of Crystal Growth, vol. 140, Issues 3-4, pp. 315-326.
IslamRaja, M. M., C. Chang, J. P. McVittie, M. A. Cappelli, and K. C. Saraswat. May/Jun. 1993. “Two Precursor Model for Low-Pressure Chemical Vapor Deposition of Silicon Dioxide from Tetraethylorthosilicate.” J. Vac. Sci. Technol. B, vol. 11, No. 3, pp. 720-726.
Jul. 12, 2004. Office Action for U.S. Appl. No. 10/173,108, filed Jun. 8, 2002.
Jun. 30, 2004. Office Action for U.S. Appl. No. 09/800,980, filed Mar. 8, 2001.
Jun. 23, 2004. Office Action for U.S. Appl. No. 10/686,589, filed Oct. 17, 2003.
Jun. 3, 2004. Office Action for U.S. Appl. No. 09/928,474, filed Aug. 14, 2001.
May 28, 2004. Office Action for U.S. Appl. No. 09/943,383, filed Aug. 31, 2001.
May 5, 2004. International Preliminary Examination Report for PCT/US01/27406.
May 5, 2004. Office Action for U.S. Appl. No. 09/943,955, filed Aug. 31, 2001.
Apr. 29, 2004. Written Opinion for PCT/US02/19061.
Apr. 28, 2004. Written Opinion for PCT/US02/19117.
Apr. 22, 2004. Office Action for U.S. Appl. No. 09/998,372, filed Nov. 30, 2001.
Apr. 9, 2004. Written Opinion for PCT/US02/19116.
Mar. 30, 2004. Written Opinion for PCT/US02/19062.
Jul. 25, 2003. International Search Report for PCT/US02/24858.
Wu, Z.C., Y.C. Lu, C.C. Chiang, M.C. Chen, B.T. Chen, G.J. Wang, Y.T. Chen, J.L. Huang, S.M. Jang, and M.S. Liang. 2002. “Advanced Metal Barrier Free Cu Damascence Interconnects with PECVD Silicon Carbide Barriers for 90/65-nm BEOL Technology.” IEEE. pp. 595-598.
Van der Straten, O., Y. Zhu, E. Eisenbraun, and A. Kaloyeros. 2002. “Thermal and Electrical Barrier Performance Testing of Ultrathin Atomic Layer Deposition Tantalum-Based Materials for Nanoscale Copper Metallization.” IEEE. pp. 188-190.
Peng, C.H., C.H. Hsieh, C.L. Huang, J.C. Lin, M.H. Tsai, M.W. Lin, C.L. Chang, Winston S. Shue, and M.S. Liang. 2002. “A 90nm Generation Copper Dual Damascene Technology with ALD TaN Barrier.” IEEE. pp. 603-606.
Elers, Kai-Erik, Ville Saanila, Pekka J. Soininen, Wei-Min Li, Juhana T. Kostamo, Suvi Haukka, Jyrki Juhanoja, and Wim F.A. Besling. 2002. “Diffusion Barrier Deposition on a Copper Surface by Atomic Layer Deposition” (Abstract). Advanced Materials. vol. 14, No. 13-14, pp. 149-153.
Kim, Y.T. and H. Sim. 2002. “Characteristics of Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect” (Abstract). IEIC Technical Report. vol. 102, No. 178, pp. 115-118.
Smith, S.R., K.E. Elers, T. Jacobs, V. Blaschke, and K. Pfeifer. 2001. “Physical and Electrical Characterization of ALD Tin Used as a Copper Diffusion Barrier in 0.25 mum, Dual Damascene Backend Structures” (Abstract). Advanced Metallization Conference 2001. Montreal, Quebec.
Eisenbraun, Eric, Oscar van der Straten, Yu Zhu, Katharine Dovidenko, and Alain Kaloyeros. 2001. “Atomic Layer Deposition (ALD) of Tantalum-Based Materials for Zero Thickness Copper Barrier Applications” (Abstract). IEEE. pp. 207-209.
Yamagishi, H., Z. Tokei, G.P. Beyer, R. Donaton, H. Bender, T. Nogami, and K. Maex. 2000. “TEM/SEM Investigation and Electrical Evaluation of a Bottomless I-PVD TA(N) Barrier in Dual Damascene” (Abstract). Advanced Metallization Conference 2000. San Diego, CA.
Tagami, M., A. Furuya, T. Onodera, and Y. Hayashi. 1999. “Layered Ta-nitrides (LTN) Barrier Film by Power Swing Sputtering (PSS) Technique for MOCVD-Cu Damascene Interconnects.” IEEE. pp. 635-638.
Sun, S.C. 1998. “CVD and PVD Transition Metal Nitrides as Diffusion Barriers for Cu Metallization.” IEEE. pp. 243-246.
Dishon, G., D. Eylon, M. Finarov, and A. Shulman. “Dielectric CMP Advanced Process Control Based on Integrated Monitoring.” Ltd. Rehoveth, Israel: Nova Measuring Instruments.
Berman, Mike, Thomas Bibby, and Alan Smith. “Review of In Situ & In-line Detection of CMP Applications.” Semiconductor Fabtech, 8th Edition, pp. 267-274.
Adams, Bret W., Bogdan Swedek, Rajeev Bajaj, Fritz Redeker, Manush Birang, and Gregory Amico. “Full-Wafer Endpoint Detection Improves Process Control in Copper CMP.” Semiconductor Fabtech—12th Edition. Applied Materials, Inc., Santa Clara, CA.
Feb. 2, 2004. Office Action for U.S. Appl. No. 09/363,966, filed Jul. 29, 1999.
Jan. 23, 2004. International Search Report for PCT/US02/24860.
Jan. 20, 2004. Office Action for U.S. Appl. No. 09/927,444, filed Aug. 13, 2001.
Cunningham, James A. 2003. “Using Electrochemistry to Improve Copper Interconnects.” .
Dec. 16, 2003. International Search Report for PCT/US03/23964.
Dec. 11, 2003. Office Action for U.S. Appl. No. 09/943,383, filed Aug. 31, 2001.
Takahashi, Shingo, Kaori Tai, Hiizu Ohtorii, Naoki Komai, Yuji Segawa, Hiroshi Horikoshi, Zenya Yasuda, Hiroshi Yamada, Masao Ishihara, and Takeshi Nogami. 2002. “Fragile Porous Low-k/Copper Integration by Using Electro-Chemical Polishing.” 2002 Symposium on VLSI Technology Digest of Technical Papers, pp. 32-33.
Sonderman, Thomas. 2002. “APC as a Competitive Manufacturing Technology: AMD's Vision for 300mm.” AEC/APC.
KLA-Tencor Corporation. 2002. “KLA Tencor: Press Release: KLA-Tencor Introduces First Production-Worthy Copper CMP In-Situ Film Thickness and End-point Control System: Multi-Million Dollar Order Shipped to Major CMP Tool Manufacturer.” www.kla-tencor.com/news—events/press—releases/press—releases2001/984086002.html.
Applied Materials, Inc. 2002. “Applied Materials: Information for Everyone: Copper Electrochemical Plating.” www.appliedmaterials.com/products/copper—electrochemical—plating.html.
Dec. 17, 2002. Office Action for U.S. Appl. No. 09/363,966, filed Jul. 29, 1999.
Nov. 12, 2002. International Search Report for PCT/US02/19063.
Nov. 11, 2002. International Search Report for PCT/US02/19117.
Nov. 7, 2002. International Search Report for PCT/US02/19061.
Oct. 23, 2002. Office Action for U.S. Appl. No. 09/469,227, filed Dec. 22, 1999.
Oct. 23, 2002. International Search Report for PCT/US01/27406.
Oct. 15, 2002. International Search Report for PCT/US02/19062.
Oct. 4, 2002. International Search Report for PCT/US01/22833.
Sep. 26, 2002. Office Action for U.S. Appl. No. 09/637,620, filed Aug. 11, 2000.
Jul. 29, 2002. International Search Report for PCT/US01/27407.
Jul. 23, 2002. Communication Pursuant to Article 96(2) EPC for European Patent Application No. 00 115 577.9.
Jul. 9, 2002. International Search Report for PCT/US01/24910.
Itabashi, Takeyuki, Hiroshi Nakano, and Haruo Akahoshi. Jun. 2002. “Electroless Deposited CoWB for Copper Diffusion Barrier Metal.” IEEE International Interconnect Technology Conference, pp. 285-287.
Jun. 20, 2002. Office Action for U.S. Appl. No. 09/619,044, filed Jul. 19, 2000.
Johnson, Bob. Jun. 10, 2002. “Advanced Process Control Key to Moore's Law.” Gartner, Inc.
Smith, Stewart, Anthony J. Walton, Alan W. S. Ross, Georg K. H. Bodammer, and J. T. M. Stevenson. May 2002. “Evaluation of Sheet Resistance and Electrical Linewidth Measurement Techniques for Copper Damascene Interconnect.” IEEE Transactions on Semiconductor Manufacturing, vol. 15, No. 2, pp. 214-222.
Good, Richard and S. Joe Qin. May 2002. “Stability Analysis of Double EWMA Run-to-Run Control with Metrology Delay.” IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 355-363.
Campbell, W. J., S. K. Firth, A. J. Toprac, and T. F. Edgar. May 2002. “A Comparison of Run-to-Run Control Algorithms (Abstract).” Proceedings of 2002 American Control Conference, vol. 3, pp. 2150-2155.
Sarfaty, Moshe, Arulkumar Shanmugasundram, Alexander Schwarm, Joseph Paik, Jimin Zhang, Rong Pan, Martin J. Seamons, Howard Li, Raymond Hung, and Suketu Parikh. Apr.-May 2002. “Advance Process Control Solutions for Semiconductor Manufacturing.” Boston, Massachusetts: 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002, pp. 101-106.
Moyne, J., V. Solakhian, A. Yershov, M. Anderson, and D. Mockler-Hebert. Apr.-May 2002. “Development and Deployment of a Multi-Component Advanced Process Control System for an Epitaxy Tool (Abstract).” 2002 IEEE Advanced Semiconductor Manufacturing Conference and Workshop, pp. 125-130.
Mar. 29, 2002. Office Action for U.S. Appl. No. 09/363,966, filed Jul. 29, 1999.
Mar. 15, 2002. Office Action for U.S. Appl. No. 09/469,227, filed Dec. 22, 1999.
NovaScan 2020. Feb. 2002. “Superior Integrated Process Control for Emerging CMP High-End Applications.”
Wang, LiRen and Hefin Rowlands. 2001. “A Novel NN-Fuzzy-SPC Feedback Control System.” 8th IEEE International Conference on Emerging Technologies and Factory Automation, pp. 417-423.
Oct. 15, 2001. Search Report prepared by the Austrian Patent Office for Singapore Patent Application No. 200004286-1.
Pilu, Maurizio. Sep. 2001. “Undoing Page Curl Distortion Using Applicable Surfaces.” IEEE International Conference on Image Processing. Thessalonica, Greece.
Heuberger, U. Sep. 2001. “Coating Thickness Measurement with Dual-Function Eddy-Current & Magnetic Inductance Instrument (Abstract).” Galvanotechnik, vol. 92, No. 9, pp. 2354-2366+IV.
Jul. 5, 2001. “Motorola and Advanced Micro Devices Buy ObjectSpace Catalyst Advanced Process Control Product for Five Wafer Fabs.” Semiconductor FABTECH. www.semiconductorfabtech.com/industry.news/9907/20.07.shtml.
Jensen, Alan, Peter Renteln, Stephen Jew, Chris Raeder, and Patrick Cheung. Jun. 2001. “Empirical-Based Modeling for Control of CMP Removal Uniformity.” Solid State Technology, vol. 44, No. 6, pp. 101-102, 104, 106. Cowan Publ. Corp.: Washington, D.C.
Tan, K. K., H. F. Dou, and K. Z. Tang. May-Jun. 2001. “Precision Motion Control System for Ultra-Precision Semiconductor and Electronic Components Manufacturing (Abstract).” 51st Electronic Components and Technology Conference 2001. Proceedings, pp. 1372-1379. Orlando, Florida.
Tobin, K. W., T. P. Karnowski, L. F. Arrowood, and F. Lakhani. Apr. 2001. “Field Test Results of an Automated Image Retrieval System (Abstract).” Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI, Munich, Germany.
Lee, Brian, Duane S. Boning, Winthrop Baylies, Noel Poduje, Pat Hester, Yong Xia, John Valley, Chris Koliopoulus, Dale Hetherington, HongJiang Sun, and Michael Lacy. Apr. 2001. “Wafer Nanotopography Effects on CMP: Experimental Validation of Modeling Methods.” San Francisco, California: Materials Research Society Spring Meeting.
Mar. 5, 2001. “KLA-Tencor Introduces First Production-worthy Copper CMP In-situ Film Thickness and End-point Control System.” http://www.kla-tencor.com/j/servlet/NewsItem?newsItemID=74.
Chen, Argon and Ruey-Shan Guo. Feb. 2001. “Age-Based Double EWMA Controller and Its Application to CMP Processes.” IEEE Transactions on Semiconductor Manufacturing, vol. 14, No. 1, pp. 11-19.
2000. “Microsense II Capacitance Gaging System.” www.adetech.com.
SEMI. 2000. “Provisional Specification for CIM Framework Scheduling Component.” San Jose, California. SEMI E105-1000.
Ravid, Avi, Avner Sharon, Amit Weingarten, Vladimir Machavariani, and David Scheiner. 2000. “Copper CMP Planarity Control Using ITM.” IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 437-443.
ACM Research Inc. 2000. “Advanced Copper Metallization for 0.13 to 0.05 μm & Beyond.” .
Khan, S., M. Musavi, and H. Ressom. Nov. 2000. “Critical Dimension Control in Semiconductor Manufacturing (Abstract).” ANNIE 2000. Smart Engineering Systems Design Conference, pp. 995-1000. St. Louis, Missouri.
Edgar, Thomas F., Stephanie W. Butler, W. Jarrett Campbell, Carlos Pfeiffer, Christopher Bode, Sung Bo Hwang, K. S. Balakrishnan, and J. Hahn. Nov. 2000. “Automatic Control in Microelectronics Manufacturing: Practices, Challenges, and Possibilities (Abstract).” Automatica, v. 36, n. 11.
Cheung, Robin. Oct. 18, 2000. “Copper Interconnect Technology.” AVS/CMP User Group Meeting, Santa Clara, CA.
Oechsner, R., T. Tschaftary, S. Sommer, L. Pfitzner, H. Ryssel, H. Gerath, C. Baier, and M. Hafner. Sep. 2000. “Feed forward Control for a Lithography/Etch Sequence (Abstract).” Proceedings of the SPIE—The International Society for Optical Engineering Conference, vol. 4182, pp. 31-39.
Chemali, Chadi El, James Moyne, Kareemullah Khan, Rock Nadeau, Paul Smith, John Colt, Jonathan Chapple-Sokol, and Tarun Parikh. Jul./Aug. 2000. “Multizone Uniformity Control of a Chemical Mechanical Polishing Process Utilizing a Pre- and Postmeasurement Strategy.” J. Vac. Sci. Technol. A, vol. 18(4). pp. 1287-1296. American Vacuum Society.
Meckl, P. H. and K. Umemoto. Apr. 2000. “Achieving Fast Motions by Using Shaped Reference Inputs [Semiconductor Manufacturing Machine] (Abstract).” NEC Research and Development, vol. 41, No. 2, pp. 232-237.
Edgar, T. F., W. J. Campbell, and C. Bode. Dec. 1999. “Model-Based Control in Microelectronics Manufacturing.” Proceedings of the 38th IEEE Conference on Decision and Control, Phoenix, Arizona, vol. 4, pp. 4185-4191.
Nov. 1999. “How to Use EWMA to Achieve SPC and EPC Control.” International Symposium on NDT Contribution to the Infrastructure Safety Systems, Tores, Brazil. .
1999. “Contactless Bulk Resistivity/Sheet Resistance Measurement and Mapping Systems.” www.Lehighton.com/fabtech/index.html.
Ruegsegger, Steven, Aaron Wagner, James S. Freudenberg, and Dennis S. Grimard. Nov. 1999. “Feedforward Control for Reduced Run-to-Run Variation in Microelectronics Manufacturing.” IEEE Transactions on Semiconductor Manufacturing, vol. 12, No. 4.
Consilium. Nov. 1999. FAB300™ Update.
Williams, Randy, Dadi Gudmundsson, Kevin Monahan, Raman Nurani, Meryl Stoller and J. George Shanthikumar. Oct. 1999. “Optimized Sample Planning for Wafer Defect Inspection,” Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on Santa Clara, CA. Piscataway, NJ. pp. 43-46.
Moyne, James. Oct. 1999. “Advancements in CMP Process Automation and Control.” Hawaii: (Invited paper and presentation to) Third International Symposium on Chemical Mechanical Polishing in IC Device Manufacturing: 196th Meeting of the Electrochemical Society.
Khan, K., C. El Chemali, J. Moyne, J. Chapple-Sokol, R. Nadeau, P. Smith, C., and T. Parikh. Oct. 1999. “Yield Improvement at the Contact Process Through Run-to-Run Control (Abstract).” 24th IEEE/CPMT Electronics Manufacturing Technology Symposium, pp. 258-263.
Consilium Corporate Brochure. Oct. 1999. www.consilium.com.
Meckl, P. H. and K. Umemoto. Aug. 1999. “Achieving Fast Motions in Semiconductor Manufacturing Machinery (Abstract).” Proceedings of the 1999 IEEE International Conference on Control Applications, vol. 1, pp. 725-729. Kohala Coast, HI.
Consilium. Jul. 1999. “Increasing Overall Equipment Effectiveness (OEE) in Fab Manufacturing by Implementing Consilium's Next-Generation Manufacturing Execution System—MES II.” Semiconductor Fabtech Edition 10.
Baliga, John. Jul. 1999. “Advanced Process Control: Soon to be a Must.” Cahners Semiconductor International www.semiconductor.net/semiconductor/issues/issues/1999/jul99/docs/feature1.asp.
Klein, Bruce. Jun. 1999. “Application Development: XML Makes Object Models More Useful.” Informationweek. pp. 1A-6A.
Pan, J. Tony, Ping Li, Kapila Wijekoon, Stan Tsai, and Fritz Redeker. May 1999. “Copper CMP Integration and Time Dependent Pattern Effect.” IEEE 1999 International Interconnect Technology Conference, pp. 164-166.
McIntosh, John. Mar. 1999. “Using CD-SEM Metrology in the Manufacture of Semiconductors (Abstract).” JOM, vol. 51, No. 3, pp. 38-39.
Consilium. Jan. 1999. “FAB300™: Consilium's Next Generation MES Solution of Software and Services which Control and Automate Real-Time FAB Operations.” www.consilium.com/products/fab300—page.htm#FAB300 Introduction.
Suzuki, Junichi and Yoshikazu Yamamoto. 1998. “Toward the Interoperable Software Design Models: Quartet of UML, XML, DOM and CORBA.” Proceedings IEEE International Software Engineering Standards Symposium. pp. 1-10.
Ouma, Dennis, Duane Boning, James Chung, Greg Shinn, Leif Olsen, and John Clark. 1998. “An Integrated Characterization and Modeling Methodology for CMP Dielectric Planarization.” Proceedings of the IEEE 1998 International Interconnect Technology Conference, pp. 67-69.
Khan, Kareemullah, Victor Solakhain, Anthony Ricci, Tier Gu, and James Moyne. 1998. “Run-to-Run Control of ITO Deposition Process.” Ann Arbor, Michigan.
Fang, S. J., A. Barda, T. Janecko, W. Little, D. Outley, G. Hempel, S. Joshi, B. Morrison, G. B. Shinn, and M. Birang. 1998. “Control of Dielectric Chemical Mechanical Polishing (CMP) Using and Interferometry Based Endpoint Sensor.” International Proceedings of the IEEE Interconnect Technology Conference, pp. 76-78.
Consilium. 1998. FAB300™. Mountain View, California: Consilium, Inc.
Chemali, Chadi El, James Moyne, Kareemullah Khan, Rock Nadeau, Paul Smith, John Colt, Jonathan Chapple-Sokol, and Tarun Parikh. Nov. 1998. “Multizone Uniformity Control of a CMP Process Utilizing a Pre and Post-Measurement Strategy.” Seattle, Washington: SEMETECH Symposium.
Consilium. Aug. 1998. Quality Management Component: QMC™ and QMC-Link™ Overview. Mountain View, California: Consilium, Inc.
Jul. 1998. “Active Controller: Utilizing Active Databases for Implementing Multistep Control of Semiconductor Manufacturing (Abstract).” IEEE Transactions on Components, Packaging and Manufacturing Technology—Part C, vol. 21, No. 3, pp. 217-224.
Moyne, James, and John Curry. Jun. 1998. “A Fully Automated Chemical-Mechanical Planarization Process.” Santa Clara, California: VLSI Multilevel Interconnection (V-MIC) Conference.
Edgar, Thomas F., Stephanie W. Butler, Jarrett Campbell, Carlos Pfeiffer, Chris Bode, Sung Bo Hwang, and K.S. Balakrishnan. May 1998. “Automatic Control in Microelectronics Manufacturing: Practices, Challenges, and Possibilities.” Automatica, vol. 36, pp. 1567-1603, 2000.
Campbell, W. Jarrett, and Anthony J. Toprac. Feb. 11-12, 1998. “Run-to-Run Control in Microelectronics Manufacturing.” Advanced Micro Devises, TWMCC.
Van Zant, Peter. 1997. Microchip Fabrication: A Practical Guide to Semiconductor Processing. Third Edition, pp. 472-478. New York, New York: McGraw-Hill.
Shindo, Wataru, Eric H. Wang, Ram Akella, and Andrzej J. Strojwas. 1997. “Excursion Detection and Source Isolation in Defect Inspection and Classification.” 2nd International Workshop on Statistical Metrology, pp. 90-93.
Durham, Jim and Myriam Roussel. 1997. “A Statistical Method for Correlating In-Line Defectivity to Probe Yield.” IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 76-77.
Reitman, E. A., D. J. Friedman, and E. R. Lory. Nov. 1997. “Pre-Production Results Demonstrating Multiple-System Models for Yield Analysis (Abstract).” IEEE Transactions on Semiconductor Manufacturing, vol. 10, No. 4, pp. 469-481.
Mullins, J. A., W. J. Campbell, and A. D. Stock. Oct. 1997. “An Evaluation of Model Predictive Control in Run-to-Run Processing in Semiconductor Manufacturing (Abstract).” Proceedings of the SPIE—The International Society for Optical Engineering Conference, vol. 3213, pp. 182-189.
Guo, Ruey-Shan, Li-Shia Huang, Argon Chen, and Jin-Jung Chen. Oct. 1997. “A Cost-Effective Methodology for a Run-by-Run EWMA Controller.” 6th International Symposium on Semiconductor Manufacturing, pp. 61-64.
Smith, Taber and Duane Boning. 1996. “A Self-Tuning EWMA Controller Utilizing Artificial Neural Network Function Approximation Techniques.” IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 355-363.
SEMI. [1986] 1996. “Standard for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM).” SEMI E10-96.
Fan, Jr-Min, Ruey-Shan Guo, Shi-Chung Chang, and Kian-Huei Lee. 1996. “Abnormal Trend Detection of Sequence-Disordered Data Using EWMA Method.” IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 169-174.
Yasuda, M., T. Osaka, and M. Ikeda. Dec. 1996. “Feedforward Control of a Vibration Isolation System for Disturbance Suppression (Abstract).” Proceeding of the 35th IEEE Conference on Decision and Control, vol. 2, pp. 1229-1233. Kobe, Japan.
Zhe, Ning, J. R. Moyne, T. Smith, D. Boning, E. Del Castillo, Yeh Jinn-Yi, and Hurwitz. Nov. 1996. “A Comparative Analysis of Run-to-Run Control Algorithms in Semiconductor Manufacturing Industry (Abstract).” IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference Workshop, pp. 375-381.
Boning, Duane S., William P. Moyne, Taber H. Smith, James Moyne, Ronald Telfeyan, Arnon Hurwitz, Scott Shellman, and John Taylor. Oct. 1996. “Run by Run Control of Chemical-Mechanical Polishing.” IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part C, vol. 19, No. 4, pp. 307-314.
Smith, Taber, Duane Boning, James Moyne, Arnon Hurwitz, and John Curry. Jun. 1996. “Compensating for CMP Pad Wear Using Run by Run Feedback Control.” Santa Clara, California: Proceedings of the Thirteenth International VLSI Multilevel Interconnection Conference. pp. 437-439.
Leang, Sovarong, Shang-Yi Ma, John Thomson, and Bart John Bombay, and Costas J. Spanos. May 1996. “A Control System for Photolithographic Sequences.” IEEE Transactions on Semiconductor Manufacturing, vol. 9, No. 2.
Dishon, G., M. Finarov, R. Kipper, J.W. Curry, T. Schraub, D. Trojan, 4th Stambaugh, Y. Li and J. Ben-Jacob. Feb. 1996. “On-Line Integrated Metrology for CMP Processing.” Santa Clara, California: VMIC Specialty Conferences, 1st International CMP Planarization Conference.
Schmid, Hans Albrecht. 1995. “Creating the Architecture of a Manufacturing Framework by Design Patterns.” Austin, Texas: OOPSLA.
Moyne, James R., Nauman Chaudhry, and Roland Telfeyan. 1995. “Adaptive Extensions to a Multi-Branch Run-to-Run Controller for Plasma Etching.” Journal of Vacuum Science and Technology. Ann Arbor, Michigan: University of Michigan Display Technology Manufacturing Center.
Chang, E., B. Stine, T. Maung, R. Divecha, D. Boning, J. Chung, K. Chang, G. Ray, D. Bradbury, O. S. Nakagawa, S. Oh, and D. Bartelink. Dec. 1995. “Using a Statistical Metrology Framework to Identify Systematic and Random Sources of Die- and Wafer-level ILD Thickness Variation in CMP Processes.” Washington, D.C.: International Electron Devices Meeting.
Telfeyan, Roland, James Moyne, Nauman Chaudry, James Pugmire, Scott Shellman, Duane Boning, William Moyne, Arnon Hurwitz, and John Taylor. Oct. 1995. “A Multi-Level Approach to the Control of a Chemical-Mechanical Planarization Process.” Minneapolis, Minnesota: 42nd National Symposium of the American Vacuum Society.
Zhou, Zhen-Hong and Rafael Reif. Aug. 1995. “Epi-Film Thickness Measurements Using Emission Fourier Transform Infrared Spectroscopy—Part II: Real-Time in Situ Process Monitoring and Control.” IEEE Transactions on Semiconductor Manufacturing, vol. 8, No. 3.
Moyne, James, Roland Telfeyan, Arnon Hurwitz, and John Taylor. Aug. 1995. “A Process-Independent Run-to-Run Controller and Its Application to Chemical-Mechanical Planarization.” SEMI/IEEE Advanced Semiconductor Manufacturing Conference and Workshop. Ann Arbor, Michigan: The University of Michigan, Electrical Engineering & Computer Science Center for Display Technology & Manufacturing.
Spanos, C. J., S. Leang, S.-Y. Ma, J. Thomson, B. Bombay, and X. Niu. May 1995. “A Multistep Supervisory Controller for Photolithographic Operations (Abstract).” Proceedings of the Symposium on Process Control, Diagnostics, and Modeling in Semiconductor Manufacturing, pp. 3-17.
Hu, Albert, He Du, Steve Wong, Peter Renteln, and Emmanuel Sachs. 1994. “Application of Run by Run Controller to the Chemical-Mechanical Planarization Process.” IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 371-378.
Tao, K. M., R. L. Kosut, M. Ekblad, and G. Aral. Dec. 1994. “Feedforward Learning Applied to RTP of Semiconductor Wafers (Abstract).” Proceedings of the 33rd IEEE Conference on Decision and Control, vol. 1, pp. 67-72. Lake Buena Vista, Florida.
Schaper, C. D., M. M. Moslehi, K. C. Saraswat, and T. Kailath. Nov. 1994. “Modeling, Identification, and Control of Rapid Thermal Processing Systems (Abstract).” Journal of the Electrochemical Society, vol. 141, No. 11, pp. 3200-3209.
Rocha, Joao and Carlos Ramos. Sep. 12, 1994. “Task Planning for Flexible and Agile Manufacturing Systems.” Intelligent Robots and Systems '94. Advanced Robotic Systems and the Real World, IROS '94. Proceedings of the IEEE/RSJ/GI International Conference on Munich, Germany Sep. 12-16, 1994. New York, New York: IEEE. pp. 105-112.
Stoddard, K., P. Crouch, M. Kozicki, and K. Tsakalis. Jun.-Jul. 1994. “Application of Feedforward and Adaptive Feedback Control to Semiconductor Device Manufacturing (Abstract).” Proceedings of 1994 American Control Conference—ACC '94, vol. 1, pp. 892-896. Baltimore, Maryland.
Muller-Heinzerling, Thomas, Ulrich Neu, Hans Georg Nurnberg, and Wolfgang May. Mar. 1994. “Recipe-Controlled Operation of Batch Processes with Batch X.” ATP Automatisierungstechnische Praxis, vol. 36, No. 3, pp. 43-51.
Mozumder, Purnendu K. and Gabriel G. Barna. Feb. 1994. “Statistical Feedback Control of a Plasma Etch Process.” IEEE Transactions on Semiconductor Manufacturing, v. 7, n. 1, pp. 1-11.
Kurtzberg, Jerome M. and Menachem Levanoni. Jan. 1994. “ABC: A Better Control for Manufacturing.” IBM Journal of Research and Development, v. 38, n. 1, pp. 11-30.
Yeh, C. Eugene, John C. Cheng, and Kwan Wong. 1993. “Implementation Challenges of a Feedback Control System for Wafer Fabrication.” IEEE/CHMT International Electronics Manufacturing Technology Symposium, pp. 438-442.
Matsuyama, Akira and Jessi Niou. 1993. “A State-of-the-Art Automation System of an ASIC Wafer Fab in Japan.” IEEE/SEMI International Semiconductor Manufacturing Science Symposium, pp. 42-47.
Hu, Albert, Kevin Nguyen, Steve Wong, Xiuhua Zhang, Emanuel Sachs, and Peter Renteln. 1993. “Concurrent Deployment of Run by Run Controller Using SCC Framework.” IEEE/SEMI International Semiconductor Manufacturing Science Symposium. pp. 126-132.
Scarr, J. M. and J. K. Zelisse. Apr. 1993. “New Topology for Thickness Monitoring Eddy Current Sensors (Abstract).” Proceedings of the 36th Annual Technical Conference, Dallas, Texas.
Feb. 1993. “Electroless Plating Scheme to Hermetically Seal Copper Features.” IBM Technical Disclosure Bulletin, pp. 405-406.
Spanos, Costas J., Hai-Fang Guo, Alan Miller, and Joanne Levine-Parrill. Nov. 1992. “Real-Time Statistical Process Control Using Tool Data.” IEEE Transactions on Semiconductor Manufacturing, v. 5, n. 4, pp. 308-318.
May 1992. “Laser Ablation Endpoint Detector.” IBM Technical Disclosure Bulletin, pp. 333-334.
Rampalli, Prasad, Arakere Ramesh, and Nimish Shah. 1991. CEPT—A Computer-Aided Manufacturing Application for Managing Equipment Reliability and Availability in the Semiconductor Industry. New York, New York: IEEE.
Zorich, Robert. 1991. Handbook of Quality Integrated Circuit Manufacturing. pp. 464-498 San Diego, California: Academic Press, Inc.
Burke, Peter A. Jun. 1991. “Semi-Empirical Modelling of SiO2 Chemical-Mechanical Polishing Planarization.” VMIC Conference, 1991 IEEE, pp. 379-384. IEEE.
Larrabee, G. B. May 1991. “The Intelligent Microelectronics Factory of the Future (Abstract).” IEEE/SEMI International Semiconductor Manufacturing Science Symposium, pp. 30-34. Burlingame, CA.
Runyan, W. R., and K. E. Bean. 1990. “Semiconducor Integrated Circuit Processing Technology.” p. 48. Reading, Massachusetts: Addison-Wesley Publishing Company.
Lin, Kuang-Kuo and Costas J. Spanos. Nov. 1990. “Statistical Equipment Modeling for VLSI Manufacturing: An Application for LPCVD.” IEEE Transactions on Semiconductor Manufacturing, v. 3, n. 4, pp. 216-229.
Herrmann, D. 1988. “Temperature Errors and Ways of Elimination for Contactless Measurement of Shaft Vibrations (Abstract).” Technisches Messen™, vol. 55, No. 1, pp. 27-30. West Germany.
Levine, Martin D. 1985. Vision in Man and Machine. New York: McGraw-Hill, Inc. pp. ix-xii, 1-58.
Oct. 1984. “Method to Characterize the Stability of a Step and Repeat Lithographic System.” IBM Technical Disclosure Bulletin, pp. 2857-2860.
Feb. 1984. “Substrate Screening Process.” IBM Technical Disclosure Bulletin, pp. 4824-4825.
Feb. 1984. “Method and Apparatus of in Situ Measurement and Overlay Error Analysis for Correcting Step and Repeat Lithographic Cameras.” IBM Technical Disclosure Bulletin, pp. 4855-4859.
Ostanin, Yu.Ya. Oct. 1981. “Optimization of Thickness Inspection of Electrically Conductive Single-Layer Coatings with Laid-on Eddy-Current Transducers (Abstract).” Defektoskopiya, vol. 17, No. 10, pp. 45-52. Moscow, USSR.
Miller, G. L., D. A. H. Robinson, and J. D., Wiley. Jul. 1976. “Contactless measurement of semiconductor conductivity by radio frequency-free-carrier power absorption.” Rev. Sci. Instrum., vol. 47, No. 7. pp. 799-805.
U.S. Appl. No. 10/759,108, filed Jan. 20, 2004, Schwarm, Automated Design and Execution of Experiments with Integrated Model Creation for Semiconductor Manufacturing Tools.
U.S. Appl. No. 10/712,273, filed Nov. 14, 2003, Kokotov, Method, System and Medium for Controlling Manufacture Process Having Multivariate Input Parameters.
U.S. Appl. No. 10/665,165, filed Sep. 18, 2003, Paik, Feedback Control of a Chemical Mechanical Polishing Process for Multi-Layered Films.
U.S. Appl. No. 10/632,107, filed Aug. 1, 2003, Schwarm et al., Method, System, and Medium for Handling Misrepresentative Metrology Data Within an Advanced Process Control System.
U.S. Appl. No. 10/393,531, filed Mar. 21, 2003, Shanmugasundram et al., Copper Wiring Module Control.
U.S. Appl. No. 10/377,654, filed Mar. 4, 2003, Kokotov et al., Method, System and Medium for Controlling Manufacturing Process Using Adaptive Models Based on Empirical Data.
U.S. Appl. No. 10/174,377, filed Jun. 18, 2002, Schwarm et al., Feedback Control of Sub-Atmospheric Chemical Vapor Deposition Processes.
U.S. Appl. No. 10/174,370, filed Jun. 18, 2002, Shanmugasundram et al., Feedback Control of Plasma-Enhanced Chemical Vapor Deposition Processes.
U.S. Appl. No. 10/173,108, filed Jun. 18, 2002, Shanmugasundram et al., Integrating Tool, Module, and Fab Level Control.
U.S. Appl. No. 10/172,977, filed Jun. 18, 2002, Shanmugasundram et al., Method, System and Medium for Process Control for the Matching of Tools, Chambers and/or Other Semiconductor-Related Entities.
U.S. Appl. No. 10/135,451, filed May 1, 2002, Shanmugasundram et al., Dynamic Metrology Schemes and Sampling Schemes for Advanced Process Control in Semiconductor Processing.
U.S. Appl. No. 10/135,405, filed May 1, 2002, Reiss et al., Integration of Fault Detection with Run-to-Run Control.
U.S. Appl. No. 10/100,184, filed Mar. 19, 2002, Al-Bayati et al., Method, System and Medium for Controlling Semiconductor Wafer Processes Using Critical Dimension Measurements.
U.S. Appl. No. 10/084,092, filed Feb. 28, 2002, Arackaparambil et al., Computer Integrated Manufacturing Techniques.
U.S. Appl. No. 09/998,384, filed Nov. 30, 2001, Paik, Feedforward and Feedback Control for Conditioning of Chemical Mechanical Polishing Pad.
U.S. Appl. No. 09/998,372, filed Nov. 30, 2001, Paik, Control of Chemical Mechanical Polishing Pad Conditioner Directional Velocity to Improve Pad Life.
U.S. Appl. No. 09/943,955, filed Aug. 31, 2001, Shanmugasundram et al., Feedback Control of a Chemical Mechanical Polishing Device Providing Manipulation of Removal Rate Profiles.
U.S. Appl. No. 09/943,383, filed Aug. 31, 2001, Shanmugasundram et al., In Situ Sensor Based Control of Semiconductor Processing Procedure.
U.S. Appl. No. 09/928,474, filed Aug. 14, 2001, Krishnamurthy et al., Experiment Management System, Method and Medium.
U.S. Appl. No. 09/928,473, filed Aug. 14, 2001, Koh, Tool Services Layer for Providing Tool Service Functions in Conjunction with Tool Functions.
U.S. Appl. No. 09/927,444, filed Aug. 13, 2001, Ward et al., Dynamic Control of Wafer Processing Paths in Semiconductor Manufacturing Processes.
U.S. Appl. No. 09/811,667, filed Mar. 20, 2001, Yuan et al., Fault Tolerant and Automated Computer Software Workflow.
U.S. Appl. No. 09/800,980, filed Mar. 8, 2001, Hawkins et al., Dynamic and Extensible Task Guide.
U.S. Appl. No. 09/725,908, filed Nov. 30, 2000, Chi et al., Dynamic Subject Information Generation in Message Services of Distributed Object Systems.
U.S. Appl. No. 09/655,542, filed Sep. 6, 2000, Yuan, System, Method and Medium for Defining Palettes to Transform an Application Program Interface for a Service.
U.S. Appl. No. 09/656,031, filed Sep. 6, 2000, Chi et al., Dispatching Component for Associating Manufacturing Facility Service Requestors with Service Providers.
U.S. Appl. No. 09/637,620, filed Aug. 11, 2000, Chi et al., Generic Interface Builder.
U.S. Appl. No. 09/619,044, filed Jul. 19, 2000, Yuan, System and Method of Exporting or Importing Object Data in a Manufacturing Execution System.
U.S. Appl. No. 09/469,227, filed Dec. 22, 1999, Somekh et al., Multi-Tool Control System, Method and Medium.
U.S. Appl. No. 09/363,966, filed Jul. 29, 1999, Arackaparambil et al., Computer Integrated Manufacturing Techniques.
“Semiconductor Manufacturing: An Overview.” .
Boning, Duane S., Jerry Stefani, and Stephanie W. Butler. Feb. 1999. “Statistical Methods for Semiconductor Manufacturing.” Encyclopedia of Electrical Engineering, J. G. Webster, Ed.
Chang, Norman H. and Costas J. Spanos. Feb. 1991. “Continuous Equipment Diagnosis Using Evidence Integration: An LPCVD Application.” IEEE Transactions on Semiconductor Manufacturing, v. 4, n. 1, pp. 43-51.
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