Method, device, computer-readable storage medium and computer program element for the monitoring of a manufacturing process of a plurality of physical objects
November 12, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMultiple-scan method for wafer particle analysis Quality management system and recording medium Method of measuring overlay offset Method of inspecting a depth of an opening of a dielectric material layer Method and apparatus for optimal wafer-by-wafer processing Method and apparatus for automated generation of test semiconductor wafers Semiconductor process yield analysis based on evaluation of parametric relationship Method, device, computer-readable memory and computer program element for the computer-aided monitoring and controlling of a manufacturing process Method, device, computer-readable storage medium and computer program element for monitoring of a manufacturing process Method, device, computer-readable storage medium and computer program element for the computer-aided monitoring of a process parameter of a manufacturing process of a physical object Patent #: 7027943 InventorAssigneeApplicationNo. 10706612 filed on 11/12/2003US Classes:438/14, WITH MEASURING OR TESTING438/17, Electrical characteristic sensed438/5, INCLUDING CONTROL RESPONSIVE TO SENSED CONDITION702/182, Performance or efficiency evaluation700/121, Integrated circuit production or semiconductor fabrication702/81, Quality evaluation700/103, Constraints or rules700/108, Performance monitoring700/109, Quality control702/83, Sampling Inspection Plan705/8Allocating resources or scheduling for an administrative functionExaminersPrimary: Schillinger, Laura MAttorney, Agent or FirmForeign Patent References
International ClassH01L 21/00AbstractIn the case of the method, an analysis is performed by using values of at least one process parameter of the manufacturing process of the physical object and, as a result of the analysis, when they satisfy a prescribed selection criterion, physical objects are marked in such a way that the associated physical objects can be taken as a random sample for the monitoring of the manufacturing process.Other References
| |
