Electronic image analyzing method and apparatus
Composite liquid cooled plate for electronic equipment
Intersecting flow network for a cold plate cooling system
Method and apparatus for cooling daughter card modules
Liquid-cooled baffle series/parallel heat sink
Printed circuit board with electronic devices mounted thereon
Method for producing a cooling element, and a cooling element
Solid-state chip cooling by use of microchannel coolant flow
Liquid cooled heat exchanger with enhanced flow
ApplicationNo. 10512902 filed on 05/07/2003
US Classes:361/699, Liquid165/80.4, Liquid cooled361/719, Circuit board mounted165/80.3, Air cooled, including fins363/141With cooling means
ExaminersPrimary: Thompson, Gregory D.
Attorney, Agent or Firm
Foreign Patent References
International ClassesH05K 7/20
AbstractA liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.