Integrated battery pack with lead frame connection
January 13, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesElectrooptical display/lead frame subassembly and timepiece module including same Space-saving back-up power supply Integrated circuit package with battery housing Semiconductor with a battery unit Molded package integrated circuit with electrochemical cell Surface mountable integrated circuit package with integrated battery mount Computer power supply system Integrated circuit carrier package with battery coin cell Encapsulation and enclosure of electronic modules Smart battery with maintenance and testing functions, communications, and display InventorAssigneeApplicationNo. 10756700 filed on 01/13/2004US Classes:438/19, HAVING INTEGRAL POWER SOURCE (E.G., BATTERY, ETC.)257/676, With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED)368/239, Optical307/150, Power packs307/66, Storage battery or accumulator257/690, With contact or lead235/492, Conductive361/820, For semiconductor device320/132, With state-of-charge detection429/96CELL SUPPORT FOR REMOVABLE CELLExaminersPrimary: Lee, CalvinAttorney, Agent or FirmForeign Patent References
International ClassesH01L 21/00H01L 23/495 AbstractAn integrated battery package, that contains semiconductor chips, for example to control and regulate battery charging and to monitor the package operation, uses a single lead frame to interconnect several internal chips, to internally connect said control chips to the battery and to connect the whole package assembly externally. The invention eliminates the need for any additional connecting mechanism. The invention uses established production processes. A molding process, similar to plastic chip encapsulation, encloses the battery controlling chips and forms at the same time the body of the battery package. An additional cover, sealed to said body, closes the battery package.Field of SearchSmall lead frame (e.g., "spider" frame) for connecting a large lead frame to a semiconductor chipWith structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED) Solder wettable contact, lead, or bond Wire contact, lead, or bond WITH PASSIVE DEVICE (E.G., CAPACITOR), OR BATTERY, AS INTEGRAL PART OF HOUSING OR HOUSING ELEMENT (E.G., CAP) Battery in combination with lead frame (EPO) Using strip lead frame Lead frame Encapsulating To form ohmic contact to semiconductive material HAVING INTEGRAL POWER SOURCE (E.G., BATTERY, ETC.) |
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