Patent ReferencesPressure controlled alignment fixture Pickup chuck for multichip modules CSP BGA test socket with insert and method Contact arm and electronic device testing apparatus using the same Patent #: 6590383 InventorAssigneeApplicationNo. 11142663 filed on 06/02/2005US Classes:324/158.1, MISCELLANEOUS324/765, Test of semiconductor device324/760, With temperature control324/755Internal of or on support for device under test (DUT)ExaminersPrimary: Nguyen, Ha TranAssistant: Nguiyen, Tuan H. Attorney, Agent or FirmForeign Patent References
International ClassG01R 31/28AbstractA first spring 54 is provided between a support member 51 driven in the Z-axis direction and a heat block 53, and biases the support member 51 and the heat block 53 in the direction of separating them from each other. A second spring 57 is provided between a first pusher 55 for pressing a die 81 of an IC device 8 and a second pusher 56 for pressing a substrate 82 of the IC device 8, and biases the first pusher 55 and the second pusher 56 in the direction of separating them from each other.Other References
Field of SearchWith probe elementsProbe contact enhancement With temperature control Test of semiconductor device MISCELLANEOUS With fluid pressure actuated pushing or pulling means APPARATUS FOR MOVING MATERIAL BETWEEN ZONES HAVING DIFFERENT PRESSURES AND INHIBITING CHANGE IN PRESSURE GRADIENT THEREBETWEEN Including means pressing against top or end of group | |