U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Cooling system for computer components

Patent 7295436 Issued on November 13, 2007. Estimated Expiration Date: Icon_subject December 10, 2025. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Fanless convection cooling design for personal computers
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Cooling structure for power supply device
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Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control panel
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Issued on: 09/24/1996
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Cooling system for computer
Patent #: 5731954
Issued on: 03/24/1998
Inventor: Cheon

Cooling system for electronic packages
Patent #: 6105662
Issued on: 08/22/2000
Inventor: Suzuki

Fanless cooling system for computer
Patent #: 6234240
Issued on: 05/22/2001
Inventor: Cheon

Cooling apparatus for electronic devices
Patent #: 6313990
Issued on: 11/06/2001
Inventor: Cheon

Microcomputer heat dissipation system
Patent #: 6747869
Issued on: 06/08/2004
Inventor: Dong

Server radiator
Patent #: 6865078
Issued on: 03/08/2005
Inventor: Chang

Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
Patent #: 6992382
Issued on: 01/31/2006
Inventor: Chrysler, et al.

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Inventor

Application

No. 11298217 filed on 12/10/2005

US Classes:

361/699, Liquid361/695, Fan or blower361/696, With heat exchanger unit361/697, With heat sink or cooling fins361/698, And liquid165/80.3, Air cooled, including fins165/80.4, Liquid cooled165/104.33, Cooling electrical device165/168, CONDUIT WITHIN, OR CONFORMING TO, PANEL OR WALL STRUCTURE174/16.1, By ventilation or gas circulation174/16.3, With heat sink174/15.1, With cooling or fluid feeding, circulating or distributing174/15.2, By heat pipe257/706, With heat sink257/708, Entirely of metal except for feedthrough257/714, Liquid coolant257/E23.098, By flowing liquids (EPO)361/690, Air361/687, With cooling means257/717Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)

Examiners

Primary: Chervinsky, Boris
Assistant: Smith, Tyrone

Attorney, Agent or Firm

International Class

H05K 7/20

Abstract

A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it leak proof. A radiator is positioned outside of the power supply housing (12). It includes a coil assembly having an inlet and an outlet. The inlet is connected to an outlet leading out from the power supply housing (12). The outlet is connected to the inlet of the power supply housing (12). During use of the computer, a cooling fluid is circulated through the coil assembly of the radiator and the power supply housing (12). A fan is positioned outwardly of the radiator and is used to cool the cooling fluid when it is in the coil assembly of the radiator.

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