Electronic substrate printing
Patent 7293691 Issued on November 13, 2007. Estimated Expiration Date: 
January 17, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 17, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesPC board panel configuration technique RE34615 Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards Monitoring deposited pads Apparatus for transporting circuit boards in a screen printer Patent #: 6374729 InventorsAssigneeApplicationNo. 10346803 filed on 01/17/2003US Classes:228/248.1, Applied in powdered or particulate form427/96.1, Integrated circuit, printed circuit, or circuit board29/840, By metal fusion427/8MEASURING, TESTING, OR INDICATINGExaminersPrimary: Stoner, KileyAttorney, Agent or FirmForeign Patent References
International ClassesB23K 31/00B05D 5/12 AbstractA system for depositing solder paste on a print window of a printed circuit board through a stencil includes a housing providing a printing chamber, a depositor configured to move relative to the housing and to deposit the solder paste, a support device disposed in the printing chamber and configured to receive the circuit board and to selectively hold the circuit board stationary relative to the housing, a loading mechanism configured to receive the circuit board and to transport the circuit board along a second direction to the support device, a controller coupled and configured to control dispensing of the solder paste by the depositor and the transporting of the circuit board by the loading mechanism, and a rotational apparatus coupled to the support device and configured to rotate the support device, where the controller is configured to cause the rotational apparatus to rotate the support device more than about 10° and to cause the depositor to deposit solder paste onto the circuit board after the rotational device has rotated the support device more than about 10°.Other References
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