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US Patent 7290596 - Thermal management of systems having localized regions of elevated heat flux
US Patent Issued on November 6, 2007
Estimated Patent Expiration Date:
October 20, 2025Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
Estimated Patent Expiration Date:
October 20, 2025Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractA thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to a localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320 or 321) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader. | InventorsAssigneeApplicationNo. 11253593 filed on 10/20/2005US Classes:165/146, GRADATED HEAT TRANSFER STRUCTURE165/185, HEAT TRANSMITTER257/707, Directly attached to semiconductor device136/204, Including additional heat exchange means361/704Thermal conductionField of Search165/80.1, WITH RETAINER FOR REMOVABLE ARTICLE165/80.2, Electrical component165/146, GRADATED HEAT TRANSFER STRUCTURE165/185, HEAT TRANSMITTER361/704Thermal conductionExaminersPrimary: Walberg, TeresaAttorney, Agent or FirmUS Patent References5456081, Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturabilityIssued on: 10/10/1995 Inventor: Chrysler, et al.5714791, On-chip Peltier cooling devices on a micromachined membrane structure Issued on: 02/03/1998 Inventor: Chi, et al.5944097, Composite substrate carrier for high power electronic devices Issued on: 08/31/1999 Inventor: Gungor, et al.5956569, Integrated thermoelectric cooler formed on the backside of a substrate Issued on: 09/21/1999 Inventor: Shiu, et al.6162659, Method for manufacturing a package structure having a heat spreader for integrated circuit chips Issued on: 12/19/2000 Inventor: Wu6256996, Nanoscopic thermoelectric coolers Issued on: 07/10/2001 Inventor: Ghoshal6347521, Temperature control device and method for manufacturing the same Issued on: 02/19/2002 Inventor: Kadotani, et al.6499306, Compact thermoelectric cooling system Issued on: 12/31/2002 Inventor: Gillen6570247, Integrated circuit device having an embedded heat slug Issued on: 05/27/2003 Inventor: Eiles, et al.6598403, Nanoscopic thermoelectric refrigerators Issued on: 07/29/2003 Inventor: Ghoshal6686532, Heat sink/heat spreader structures and methods of manufacture Issued on: 02/03/2004 Inventor: Macris6712258, Integrated quantum cold point coolers Issued on: 03/30/2004 Inventor: Ghoshal6743972, Heat dissipating IC devices Issued on: 06/01/2004 Inventor: Macris6826916Laser module, Peltier module, and Peltier module integrated heat spreader Issued on: 12/07/2004 Inventor: Shimada, et al. International ClassF28F 7/00 |
