Thermal management of systems having localized regions of elevated heat flux
October 20, 2025. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesThermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability On-chip Peltier cooling devices on a micromachined membrane structure Composite substrate carrier for high power electronic devices Integrated thermoelectric cooler formed on the backside of a substrate Method for manufacturing a package structure having a heat spreader for integrated circuit chips Nanoscopic thermoelectric coolers Temperature control device and method for manufacturing the same Compact thermoelectric cooling system Integrated circuit device having an embedded heat slug Nanoscopic thermoelectric refrigerators InventorsAssigneeApplicationNo. 11253593 filed on 10/20/2005US Classes:165/146, GRADATED HEAT TRANSFER STRUCTURE165/185, HEAT TRANSMITTER257/707, Directly attached to semiconductor device136/204, Including additional heat exchange means361/704Thermal conductionExaminersPrimary: Walberg, TeresaAttorney, Agent or FirmInternational ClassF28F 7/00AbstractA thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to a localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320 or 321) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader. | |
