U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Thermal management of systems having localized regions of elevated heat flux

Patent 7290596 Issued on November 6, 2007. Estimated Expiration Date: Icon_subject October 20, 2025. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

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Inventors

Assignee

Application

No. 11253593 filed on 10/20/2005

US Classes:

165/146, GRADATED HEAT TRANSFER STRUCTURE165/185, HEAT TRANSMITTER257/707, Directly attached to semiconductor device136/204, Including additional heat exchange means361/704Thermal conduction

Examiners

Primary: Walberg, Teresa

Attorney, Agent or Firm

International Class

F28F 7/00

Abstract

A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to a localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320 or 321) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.

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