Granular epoxy resin, production method thereof, and granular epoxy resin package
Patent 7285602 Issued on October 23, 2007. Estimated Expiration Date: 
March 5, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
March 5, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesEpoxy resin composition Aqueous, essentially voc-free adhesive epoxy primer Epoxy resin composition for semiconductor encapsulation Phenolic hydroxyl-containing resin by reacting epoxy resin with excess difunctional phenol and epoxidation thereof Epoxy resin composition for semiconductor encapsulation Epoxy resin composition and process for producing the same Patent #: 6548620 InventorsAssigneeApplicationNo. 10792859 filed on 03/05/2004US Classes:525/481, Mixed with reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom525/480, Solid polymer or specified intermediate condensation product derived from at least one phenolic reactant and at least one aldehyde or aldehyde-type reactant or polymer therefrom525/523, Solid polymer contains more than one 1,2-epoxy group or is derived from reactant containing at least one 1,2-epoxy group525/524, Mixed with a reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom525/525, Wherein at least one of said 1,2-epoxy reactants or polymer derived therefrom contains atoms other than C, H, or O428/130, Particular fold structure (e.g., beveled, etc.)428/137, Composite web or sheet428/138, Including nonapertured component523/466, Inorganic SI-O bond DNRM523/404, With organic nitrogen or organic sulfur reactant523/443, Silicon523/427, Composition wherein two or more polymers or a polymer and a reactant all contain more than one 1,2-epoxy group, or product thereof528/89Material contains a phosphorus atomExaminersPrimary: Sellers, Robert E.Attorney, Agent or FirmForeign Patent References
International ClassesC08L 63/02C08L 63/04 B32B 3/04 B32B 3/10 AbstractA granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportationOther References
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