Mold release layer transferring film and laminate film
March 11, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3503782 3554835 Pressure-sensitive adhesive structure Pressure sensitive adhesive/release liner laminate Structured flexible carrier web with recess areas bearing a layer of silicone on predetermined surfaces Laminate article comprising moisture-curable silicone pressure sensitive adhesive and release liner Roller-shaped stamper for fabricating optical scales In-line method for laminating silicone-coated polyester film to paper, and laminate produced thereby Release liner base stock for printed films or labels Transfer paper for electrophotography InventorsAssigneeApplicationNo. 10507242 filed on 03/11/2003US Classes:428/352, With release or antistick coating428/41.4, Silicon428/42.3, Adhesive is on removable layer428/209, Including metal layer428/354, Three or more layers257/642, At least one layer of organic material174/254, Convertible shape (e.g., flexible) or circuit (e.g., breadboard)174/255, With particular substrate or support structure156/329, Silicon resin156/344, Delaminating, per se428/211.1, Including paper layer156/234, Of portion only of lamina from carrier428/40.7, Fluorine428/156, Including variation in thickness428/40.1, LAYER OR COMPONENT REMOVABLE TO EXPOSE ADHESIVE428/41.3Polymer derived only from ethylenically unsaturated monomerExaminersPrimary: Lam, Cathy F.Attorney, Agent or FirmForeign Patent References
International ClassesB32B 7/12H01L 23/58 H05K 1/03 AbstractProvision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line.The releasing layer transfer film 1 for forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrate 2 and a transferable releasing layer 3 provided on a surface of the transfer film substrate 2, wherein the transferable releasing layer 3 is formed from a releasing agent and can be transferred onto the insulating layer.Field of SearchWith release or antistick coatingThree or more layers LAYER OR COMPONENT REMOVABLE TO EXPOSE ADHESIVE Sectional layer removable Adhesive is on removable layer Silicon Including metal layer At least one layer of organic material Convertible shape (e.g., flexible) or circuit (e.g., breadboard) With particular substrate or support structure Silicon resin Delaminating, per se | |
