Electroplating bath containing wetting agent for defect reduction
June 29, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesAqueous acidic bath for electrochemical deposition of a shiny and tear-free copper coating and method of using same Plated copper interconnect structure Electro deposition chemistry Electro-chemical deposition system and method of electroplating on substrates Electrolytic copper plating method Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect Voltammetric measurement of halide ion concentration Defect-free thin and planar film processing Patent #: 6943112 InventorsAssigneeApplicationNo. 10879613 filed on 06/29/2004US Classes:205/298, And organic sulfur compound-containing205/296, Utilizing organic compound-containing bath205/297, Nitrogen-heterocyclic compound-containing205/123, Product is semiconductor or includes semiconductor205/125, Product is circuit board or printed circuit257/762, At least one layer containing silver or copper205/96, Controlling current distribution within bath205/81, Involving measuring, analyzing, or testing438/687, Copper of copper alloy conductor106/1.18Metal-depositing composition contains elemental metal of Group IB (Cu, Ag, Au)ExaminersPrimary: Wong, DonAttorney, Agent or FirmInternational ClassesC25D 3/38C25D 5/02 AbstractAn electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating solution. In some embodiments, the wetting agent decreases the air-liquid surface tension of the electroplating solution to 60 dyne/cm2 or less to increase the wetting ability of the solution with a substrate surface. In some embodiments of a method for plating metal onto substrate surface, the electroplating solution has a measured contact angle with the substrate surface less than 60 degrees.Other References
Field of SearchDepositing predominantly alloy coatingCopper-containing alloy Depositing predominantly single metal coating Utilizing organic compound-containing bath ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) Involving measuring, analyzing, or testing Product is semiconductor or includes semiconductor Nitrogen-heterocyclic compound-containing And organic sulfur compound-containing |
| ||||||||||||||
