Latent curing agent for epoxy resin, and curable epoxy resin composition
Patent 7226976 Issued on June 5, 2007. Estimated Expiration Date: 
April 21, 2025. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 21, 2025. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesUnitary curable resin compositions Air drying thermosetting aqueous epoxy-acrylic copolymer coating systems Co-curing agents for epoxy resins Coating composition Solid solutions of polymeric phenols and polyamines as epoxy curing agents Adhesive composition Patent #: 5480720 InventorsAssigneeApplicationNo. 11110731 filed on 04/21/2005US Classes:525/218, Nitrogen reactant contains a carboxylic acid amide group525/57, With solid polymer derived from ethylenic reactants only525/107, With saturated 1,2-epoxy reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom; or with solid copolymer derived from at least one saturated reactant and at least one unsaturated 1,2-epoxy reactant wherein the epoxy reactant contains more than one 1,2-epoxy group per mole525/108, Contacting two or more solid polymers derived from ethylenic reactants only with a poly 1,2-epoxy-containing reactant; or contacting a solid polymer derived from ethylenic reactants only with a poly 1,2-epoxy-containing reactant and subsequently contacting with an additional polymer derived from ethylenic reactants only525/132, With saturated phenolic reactant or polymer thereof; or with solid copolymer derived from at least one phenolic reactant wherein at least one of the reactants forming the solid copolymer is saturated; or with SPFI wherein at least one of the necessary ingredients is a phenolic reactant or with a reaction product thereof; or with a SICP containing a phenolic group Si-H or Si-C bond525/176, Solid polymer derived from ethylenic reactants only derived from at least one reactant containing an oxygen atom525/217Solid polymer derived from reactant containing nitrogen atom other than from (meth)acrylonitrileExaminersPrimary: Sellers, Robert E.Attorney, Agent or FirmForeign Patent References
International ClassesC08L 33/04C08L 33/24 C08L 63/00 C08L 63/02 AbstractProvided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C. | |
