U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Electromechanical device having a plurality of bundles of fibers for interconnecting two planar surfaces

Patent 7220131 Issued on May 22, 2007. Estimated Expiration Date: Icon_subject September 12, 2026. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

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Inventors

Assignee

Application

No. 11530932 filed on 09/12/2006

US Classes:

439/65, With provision to conduct electricity from panel circuit to another panel circuit174/119R, Composite or noncircular strand section174/262, Feedthrough310/251, Structure (e.g., composite material)174/124R, Fibrous or fabric428/221WEB OR SHEET CONTAINING STRUCTURALLY DEFINED ELEMENT OR COMPONENT

Examiners

Primary: Prasad, Chandrika

Attorney, Agent or Firm

International Classes

H01R 12/00
H05K 1/00

Abstract

According to various embodiments, exemplary interconnects and methods for interconnection are provided that can include contacts formed by fiber bundles. The exemplary interconnects can be used to form separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. In various embodiments, the exemplary interconnects can allow management of the thermal properties of the electronic devices. Exemplary interconnects can also provided reduced thickness allowing redundancy and additional compliance as desired.

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