U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Electrohydrodynamically (EHD) enhanced heat transfer system and method with an encapsulated electrode

Patent 7159646 Issued on January 9, 2007. Estimated Expiration Date: Icon_subject April 15, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3056587

3344853

3681896

3872917

Heat exchange arrangement
Patent #: 4056142
Issued on: 11/01/1977
Inventor: Baumann ,   et al.

Plate heat exchangers
Patent #: 4207942
Issued on: 06/17/1980
Inventor: Cowan ,   et al.

Electrohydrodynamic inductively pumped heat pipe
Patent #: 4396055
Issued on: 08/02/1983
Inventor: Mitchell, Jr.

Method for augmentation of condensation heat transfer by application of non-uniform electric field
Patent #: 4401148
Issued on: 08/30/1983
Inventor: Yabe ,   et al.

Augmentation method of boiling heat transfer by applying electric fields
Patent #: 4471833
Issued on: 09/18/1984
Inventor: Yabe ,   et al.

Active regulation of heat transfer
Patent #: 4515206
Issued on: 05/07/1985
Inventor: Carr

More ...

Inventors

Assignee

Application

No. 10413294 filed on 04/15/2003

US Classes:

165/96, WITH ADJUSTOR FOR HEAT, OR EXCHANGE MATERIAL, FLOW165/104.23, By direct application of electrical energy to heat exchange material392/324, Steam or vapor generator165/166Stacked plates or shells form interplate passages

Examiners

Primary: Duong, Tho

Attorney, Agent or Firm

International Classes

F28F 27/00
H05K 7/20

Abstract

An electrohydrodynamically enhanced heat transfer system (EHD) includes an electrode completely encapsulated in an insulating material and coupled to a power supply to generate an electric field between a heat transfer surface and the encapsulated electrode when energized for interacting with the heat exchange surface and the working media to reduce frost formation on the heat transfer surface and to enhance heat transfer. The power supply may be completely encapsulated and immersed into the working media. In order to reduce accumulation of condensed liquid onto the electrode, the surface of the insulating material of the encapsulated electrode is either covered with a water repellent, or heated a few degrees above the dew point temperature of the air surrounding the heat transfer surface. The encapsulated electrode can be energized by an AC or DC electric field through a controlling switch.

Other References

  • Akira Yabe et al., “Active Heat Transfer Enhancement by Utilizing Electric Fields”, Annual Review of Heat Transfer, 1996, p. 193-244, Vol. 07, Begell House.
  • John T. Bartelett et al., “The Growth of Ice Crystals in an Electric Field”, Zeitschrift For Angewandte Mathematik und Physik, 1963, p. 598-611, vol. 14.
  • M. Arif-Uz-Zaman et al., “ANovel Dehumidification Technique Using Electric Field”, IEEE Transactions on Industry Applications, Jan. 1996, p. 36-40, vol. 32, No. 1.
  • F.M.J. McCluskey et al., “Heat Transfer Enhancement By Electroconvection Resulting From an Injected Space Charge Between Parallel Plates”, Ins. J. Heat Mass Transfer, 1991, p. 2237-2250, Vol. 34, No. 09, Great Britain.
  • G.J. Pietsch, “Properties of Dielectric Barrier Discharges in Different Arrangements”.
  • Peng Zhang, “Atmospheric Pressure Dielectric Barrier Glow Discharge and its Numerical Simulation”.
  • M. M. Ohadi, et al., “Electrode Materials Sciences, Design, Fabrication, and Materials Sciences for EHD-Enhanced Heat and Mass Transport”, Annual Review of Heat Transfer, Begell House, 2001, vol. 11, pp. 563-623.
  • L. W. Da Silva, et al., “Electrohydrodynamic Enhancement of R-134a Condensation on Enhanced Tubes”, 35th IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy, Oct. 8-12, 2000, Conference Record—IAS Annual Meeting (IEEE Industry Applications Society) Rome, Italy, vol. 2, pp. 757-764.
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