U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Optical fiber pressure and acceleration sensor fabricated on a fiber endface

Patent 7054011 Issued on May 30, 2006. Estimated Expiration Date: Icon_subject August 5, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Optical measuring device using a spectral modulation sensor having an optically resonant structure
Patent #: 4678904
Issued on: 07/07/1987
Inventor: Saaski ,   et al.

Method for producing reflective taps in optical fibers and applications thereof
Patent #: 4848999
Issued on: 07/18/1989
Inventor: Taylor

In-line fiber etalon strain sensor Patent #: 5528367
Issued on: 06/18/1996
Inventor: Putnam, et al.

Inventors

Assignee

Application

No. 10911635 filed on 08/05/2004

US Classes:

356/480, Resonant cavity65/407End to end (i.e., butt end joining)

Examiners

Primary: Toatley, Gregory J. Jr.
Assistant: Lyons, Michael A.

Attorney, Agent or Firm

International Class

G01B 9/02

Abstract

A fiber optic sensor has a hollow tube bonded to the endface of an optical fiber, and a diaphragm bonded to the hollow tube. The fiber endface and diaphragm comprise an etalon cavity. The length of the etalon cavity changes when applied pressure or acceleration flexes the diaphragm. The entire structure can be made of fused silica. The fiber, tube, and diaphragm can be bonded with a fusion splice. The present sensor is particularly well suited for measuring pressure or acceleration in high temperature, high pressure and corrosive environments (e.g., oil well downholes and jet engines). The present sensors are also suitable for use in biological and medical applications.

Other References

  • Chen et al.; “Deep Wet Etching on Fused Silica Material for Fiber Optic Sensors”; Proceedings of SPIE—vol. 5342 Micromachining and Microfabrication Process Technology IX; Jan. 2004, pp. 128-136.
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