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| InventorsApplication No. 10465797 filed on 06/20/2003 US Classes:257/315, With floating gate electrode257/316, With additional contacted control electrode257/17, With particular barrier dimension438/257, Having additional gate electrode surrounded by dielectric (i.e., floating gate)365/151, Molecular or atomic257/261, Junction gate region free of direct electrical connection (e.g., floating junction gate memory cell structure)423/348, Elemental silicon257/317With irregularities on electrode to facilitate charging or discharging of floating electrodeField of Search257/315, With floating gate electrode257/316, With additional contacted control electrode257/616, Containing germanium, Ge438/257Having additional gate electrode surrounded by dielectric (i.e., floating gate)Examiners Primary: Prenty, Mark V.Attorney, Agent or FirmUS Patent References4045302, Multilevel metallization process Issued on: 08/30/1977 Inventor: Gibbs , et al.5714766, Nano-structure memory device Issued on: 02/03/1998 Inventor: Chen, et al.5849215, Highly ordered nanocomposites via a monomer self-assembly in situ condensation approach Issued on: 12/15/1998 Inventor: Gin, et al.5948470, Method of nanoscale patterning and products made thereby Issued on: 09/07/1999 Inventor: Harrison, et al.6069380, Single-electron floating-gate MOS memory Issued on: 05/30/2000 Inventor: Chou, et al.6090666, Method for fabricating semiconductor nanocrystal and semiconductor memory device using the semiconductor nanocrystal Issued on: 07/18/2000 Inventor: Ueda, et al.6139713Method of manufacturing porous anodized alumina film Issued on: 10/31/2000 Inventor: Masuda, et al.Foreign Patent References- 1 256 986 EP 11/01/2002
- 2001-233674 JP 08/01/2001
International Class H01L 29/788
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