High energy density capacitors
Patent 7023687 Issued on April 4, 2006. Estimated Expiration Date: 
May 12, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 12, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesHigh dielectric constant ink for thick film capacitors Method for manufacturing dielectric metal titanate Method for roughening ceramic substrate surface and method for manufacturing printed circuit board using surface-roughened ceramic substrate Amorphous thin film electrode materials from hydrous metal oxides Capacitor and manufacturing method thereof Patent #: 5790368 InventorsAssigneeApplicationNo. 10513361 filed on 05/12/2003US Classes:361/306.3, For multilayer capacitor361/321.2, With multilayer ceramic capacitor361/303, Significant electrode feature106/31.92, Electrically conductive or magnetic compositions (e.g., electrically sensitive, electrochemical, electrolytic, etc.)361/503, Liquid electrolytic capacitor361/523, Solid electrolytic capacitor (e.g., dry electrolytic capacitor)501/20With vehicle or suspending agent (i.e., slip)ExaminersPrimary: Dinkins, AnthonyAttorney, Agent or FirmForeign Patent References
International ClassH01G 4/228AbstractCapacitors having an inert porous shaped body onto which a first electrically conductive layer, a second layer of barium titanate and a further electrically conductive layer have been applied. | |
