Rail stack array of charge storage devices and method of making same
Patent 6992349 Issued on January 31, 2006. Estimated Expiration Date: May 20, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
There is provided a monolithic three dimensional array of charge storage devices which includes a plurality of device levels, wherein at least one surface between two successive device levels is planarized by chemical mechanical polishing.
Other References
Copending U.S. Appl. No. 10/842,008, Lee at al., May. 10, 2004.
John H. Douglas: “The Route to 3-D Chips,” High Technology, Sep. 1983, pp. 55-59, vol. 3, No. 9, High Technology Publishing Corporation, Boston, MA.
M. Arienzo et al.: “Diffusion of Arsenic in Bilayer Polycrystalline Silicon Films,” J. Appl. Phys., Jan. 1984, pp. 365-369, vol. 55, No. 2, American Institute of Physics.
O. Bellezza et al.: “A New Self-Aligned Field Oxide Cell for Multimegabit Eproms,” IEDM. pp. 579-582, IEEE.
S.D. Brotherton et al.: “Excimer-Laser-Annealed Poly-Si Thin-Film Transistors,” IEEE Transactions on Electron Devices, Feb. 1993, pp. 407-413, vol. 40, No. 2, IEEE.
P. Candelier et al.: “Simplified 0.35μm Flash EEPROM Process Using High-Temperature Oxide (HTO) Deposited by LPCVD as Interpoly Dielectrics and Peripheral Transistors Gate Oxide,” IEEE Electron Device Letters, Jul. 1997, pp. 306-308, vol. 18, No. 7, IEEE.
Min Cao et al.: “A High-Performance Polysilicon Thin-Film Transistor Using XeCl Excimer Laser Crystallization of Pre-Patterned Amorphous Si Films,” IEEE Transactions on Electron Devices, Apr. 1996, pp. 561-567, vol. 43, No. 4, IEEE.
Mino Cao et al.: “A Simple EEPROM Cell Using Twin Polysilicon Thin Film Transistors,” IEEE Electron Device Letters, Aug. 1994, pp. 304-306, vol. 15, No. 8, IEEE.
Bomy Chen et al.: “Yield Improvement for a 3.5-ns BICOMS Technology in a 200-mm Manufacturing Line,” IBM Technology Products, 1993, pp. 301-305, VLSITSA.
Victor W.C. Chan et al.: “Three Dimensional CMOS Integrated Circuits on Large Grain Polysilicon Films,” IEDM, 2000, IEEE.
Boaz Eitan et al.: “Alternate Metal Virtual Ground (AMG)—A New Scaling Concept for Very High-Density EPROM's,” IEEE Electron Device Letters, pp. 450-452, vol. 12, No. 8, Aug. 1991, IEEE.
Boaz Eitan et al.: “Multilevel Flash cells and their Trade-offs,” IEEE Electron Device Letters , pp. 169-172, 1996, IEEE.
Dr. Heinrich Endert: “Excimer Lasers as Tools for Material Processing in Manufacturing,” Technical Digest: International Electron Devices Meeting, 1985, pp. 28-29, Washington, DC, Dec. 1-4, 1985, Göttingen, Germany.
G.K. Giust et al., “Laser-Processed Thin-Film Transistors Fabricated from Sputtered Amorphous-Silicon Films,” IEEE Transactions on Electron Devices, pp. 207-213, vol. 47, No. 1, Jan. 2000, IEEE.
G.K. Giust et al.: “High-Performance Thin-Film Transistors Fabricated Using Excimer Laser Processing and Grain Engineering,” IEEE Transactions on Electron Devices, pp. 925-932, vol. 45, No. 4, Apr. 1998, IEEE.
G.K. Giust et al.: “High-Performance Laser-Processed Polysilicon Thin-Film Transistors,” IEE Electron Device Letters, pp. 77-79, vol. 20, No. 2, Feb. 1999, IEEE.
Fumihiko Hayashi et al.: “A Self-Aligned Split-Gate Flash EEPROM Cell with 3-D Pillar Structure,” 1999 Symposium on VLSI Technology Digest of Technical Papers, pp. 87-88, Stanford University, Stanford, CA 94305, USA.
Stephen C.H. Ho et al.: “Thermal Stability of Nickel Silicides in Different Silicon Substrates,” Department of Electrical and Electronic Engineering, pp. 105-108, 1998, IEEE.
J. Esquivel et al. “High Density Contactless, Self Aligned EPROM Cell Array Technology, ” Texas Instruments (Dallas), IEDM 86, pp. 592-595, 1986, IEEE.
R. Kazerounian et al.: Alternate Metal Virtual Ground EPROM Array Implemented in a 0.8μm Process for Very High Density Applications, IEDM 91, pp. 311-314, 1991, IEEE.
Chang-Dong Kim et al.: “Short-Channel Amorphous-Silicon Thin-Film Transistors,” IEEE Transactions on Electron Devices, pp. 2172-2176, vol. 43, No. 12, December 1996, IEEE.
Johan H. Klootwijk et al.: “Deposited Inter-Polysilicon Dielectrics for Nonvolatie Memories,” IEEE Transactions on Electron Devices, pp. 1435-1445, vol. 46, No. 7, Jul. 1999, IEEE.
Webpage—Ja-Hum Ku et al.: “High Performance pMOSFETs With Ni(Si/sub x/Ge/sub 1−x Si/Sub 0.8/Ge/sub 0.2/ gate, IEEE Xplore Citation,” VLSI Technology, 200. Digest of Technical Paper Symposium on pages(s): 114-115 Jun. 13-15, 2000.
Nae-In Lee et al.: “High-Performance EEPROM's Using N- and P-Channel Polysilicon Thin-Film Transistors with Electron Cyclotron Resonance N20-Plasma Oxide,” pp.15-17, IEEE Electron Device Letters, vol. 20, No. 1, Jan. 1999, IEEE.
Jin-Woo Lee et al.: “Improved Stability of Polysilicon Thin-Film Transistors under Self-Heating and High Endurance EEPROM Cells for Systems-On-Panel,” IEEE Electron Device Letters, 1998, pp. 265-268, IEEE.
Seok-Woon Lee et al.: “Pd induced lateral crystallization of Amorphous Si Thin Films,” Appl. Phys. Lett. 66(13), pp. 1671-1673, Mar. 27, 1995, American Institute of Physics.
K. Miyashita etal.: “Optimized Halo Structure for 80 nm Physical Gate CMOS Technology with indium and Antimony Highly Angled lon Implantation,” IEDM 99-645, pp. 27.2.1-27.2.4, 1999, IEEE.
N.D. Young et al.: “The Fabrication and Characterization of EEPROM Arrays on Glass Using a Low-Temperature Poly-Si TFT Process,” IEEE Transactions on Electron Devices, pp. 1930-1936, vol. 43, No. 11, Nov. 1996, IEEE.
Jung-Hoon Oh et al.: “A High-Endurance Low-Temperature Polysilicon Thin-Film Transistor EEPROM Cell,” pp. 304-306, IEEE Electron Device Letters, vol. 21, No. 6, Jun. 2000, IEEE.
Webpage—M.C. Poon. et al.: “Thermal Stability of Cobalt and Nickel Silicides in Amorpho Crystalline Silicon,” p. 1, IEEE Xplore, Electron Devices Meeting, 1997, Proceedings, 19 Hong Kong, 2000, IEEE.
Noriaki Sato et al.: “A New Programmable Cell Utilizing Insulator Breakdown,” IEDM 85, pp. 639-642, 1985, IEEE.
Takeo Shiba et al.: “In Situ Phosphorus-Doped Polysilicon Emitter Technology for Very High-Speed, Small Emitter Bipolar Transistors,” IEEE Transactions on Electron Devices, pp. 889-897, vol. 43, No. 6, Jun. 1996, IEEE.
Seungheon Song et al.: “High Performance Transistors with State-of-the-Art CMOS Technologies,” IEDM 99, pp. 427-430, 1999, IEEE.
Yoshihiro Takao et al. “Low-Power and High-Stability SRAM Technology Using a Laser-Recrystallized p-Channel SOI MOSFET,” IEEE Transactions on Electron Devices, pp. 2147-2152, vol. 39, No. 9, Sep. 1992, IEEE.
Kenji Taniguchi et al.: “Process Modeling and Simulation: Boundary Conditions for Point Defect-Based Impurity Diffusion Model,” IEEE Transactions on Computer-Aided Design , pp. 1177-1183, vol. 9, No. 11, Nov. 1990, IEEE.
Hongmei Wang et al.: “Submicron Super TFTs for 3-D VLSI Applications,” IEEE Electron Device Letters, pp. 391-393, vol. 21, No. 9, Sep. 2000, IEEE.
Hongmei Wang et al.: “Submicron Super TFTs for 3-D VLSI Applications,” IEEE Electron Device Letters, vol. 21, No. 9, pp. 439-441, Sep. 2000, IEEE.
Hongmei Wang et al.: “Super Thin-Film Transistor with SOI CMOS Performance Formed by a Novel Grain Enhancement Method,” IEEE Transactions on Electron Devices, pp. 1580-1586, vol. 47, No. 8, Aug. 2000, IEEE.
Marvin H. White et al. “On the Go With Sonos,” Circuit & Devices, pp. 22-31, Jul. 2000, IEEE.
B.J. Woo et al.: “A Novel Memory Cell Using Flash Array Contactless Eprom (Face) Technology,” IEDM, pp. 90-93, 1990, IEEE.
Qi Xiang et al.: “Deep sub-100 nm CMOS with Ultra Low Gate Sheet Resista NiSi,” VLSI Technology, 2000. Digest of Technical Paper Symposium on . . . pp. 76-77, IEEE Xplore, Jun. 13-15, 2000.
Qi Xiang et al.: “Deep sub-100nm CMOS with Ultra Low Gate Sheet Resistance by NiSi,” IEEE, pp. 76-77, 2000, Symposium on VLSI Technology Digest of Technical Papers.
Qiuxia Xu et al.: “New Ti-SALICIDE Process Using Sb and Ge Preamorphization for Sub-0.2 μm CMOS Technology,” IEEE Transactions on Electron Devices, pp. 2002-2009, vol. 45, No. 9, Sep. 1998, IEEE.
Kuniyoshi Yoshikawa et al.: “An Asymmetrical Lightly Doped Source Cell for Virtual Ground High-Density EPROM's,” IEEE Transactions on Electron Devices, pp. 1046-1051, vol. 37, No. 4, Apr. 1990, IEEE.
John R. Lindsey et al.: “Polysilicon Thin Film Transistor and EEPROM Characteristics for Three Dimensional Memory,” 198th Meeting of The Electrochemical Society, Meeting Abstracts, vol. 2000-2, Phoenix, Oct. 22-27, 2000.
Vivek Subramanian: “Control of Nucleation and Grain Growth in Solid-Phrase Crystallized Silicon for High-Performance Thin Film Transistors,” A Dissertation submitted to the Department of Electrical Engineering and the Committee of Graduate Studies of Stanford University, 1998.
Brian Dipert: “Exotic Memories, Diverse Approaches,” EDN Asia, Sep. 2000.
Dietmar Gogl et al.: “A 1-Kbit EEPROM in SIMOX Technology for High-Temperature Applications up to 250° C,” IEEE Journal of Solid-State Circuits, Oct. 2000, vol. 35, No. 10, IEEE.
3D-ROM-A First Practical Step Towards 3D-IC by G. Zhang, Semiconductor International, Jul. 2000.
Chan et al. “Three Dimensional CMOS integrated Circuits on Large Grain Polysilicon Films” EEE, Hong Kong University of Science and Technology 2000 IEEE.
Abstract “Looking Diverse Storage”, Electronic Engineering Times, Oct. 31, 1994, p. 44.
Abstract “Special Report: Memory Market Startups Cubic Memory: 3D Space Savers”, Semiconductor Industry & Business Survey, vol. 16, No. 13, Sep. 12, 1994.
Abstract “Technique Boosts 3D Memory Density”, Electronic Engineering Times, Aug. 29, 1994, p. 16.
Abstract “Memory Packs Poised 3D Use”, Electronic Engineering Times, Dec. 7, 1992, p. 82.
Abstract “MCMs Hit the Road”, Electronic Engineering Times, Jun. 15, 1992, p. 45.
Abstract “IEDM Ponders the ‘Gigachip’ Era”, Electronic Engineering Times, Jan. 20, 1992, p. 33.
Abstract “Tech Watch: 1-Gbit DRAM in Sight”, Electronic World News, Dec. 16, 1991, p. 20.
Abstract “MCMs Meld into Systems”, Electronic Engineering Times, Jul. 22, 1991, p. 35.
Abstract “Systems EEs See Future In 3D”, Electronic Engineering Times, Sep. 24, 1990, p. 37.
Makiniak David: “Vertical integration of Silicon Allows Packaging of Extremely Dense System Memory In Tiny Volumes: Memory-chip Stacks Send Density Skyward”, Electronic Design, No. 17, Aug. 22, 1994, pp. 69-75, Cleveland Ohio.
Yamazaki K.: “Fabrication Technologies for Dual 4-KBIT Stacked SRAM”, IEDM 16.8., 1986, pp. 435-438.
Pein Howard: “Performance of the 3-D PENCIL Flash EPROM Cell an Memory Array”, IEEE Transactions on Electron Devices, vol. 42, No. 11, Nov. 1995, pp. 1982-1991.
Abstract Lomatch S.: “Multilayered Josephson Junction Logic and Memory Devices”, Proceedings of the SPIE-The International Society for Optical Engineering vol. 2157, pp. 332-343.
Abstract LU N.C.C.: “Advanced Cell Structures for Dynamic RAMs”, IEEE Circuits and Devices Magazine, vol. 5, No. 1, Jan. 1989, pp. 27-36.
Abstract Sakamato K.: “Architecture of Three Dimensional Devices”, Journal: Bulletin of the Electrotechnical Laboratory, vol. 51, No. 1, 1987, pp. 16-29.
Abstract “Wide Application of Low-Cost Associative Processing Associative Processing Seen”, Electronic Engineering Times, Aug. 26, 1996, p. 43.
Abstract “Technologies Will Pursue Higher DRAM Densities”, Electronic News (1991), Dec. 4, 1994, p. 12.
Carter William H.: “National Science Foundation (NSF) Forum on Optical Science and Engineering”, Proceedings SPIE—The International Society for Optical Engineering, vol. 2524, Jul 11-12, 1995, (Article by N. Joverst titled “Manufacturable Multi-Material Integration Compound Semi-conductor Devices Bonded to Silicon Circuity”.
Hayashi Y.: “A New Three Dimensional IC Fabrication Technology, Stacking Thin Film Dual-CMOS Layers”, IEDM, 1991, pp. 25.6.1-25.6.4.
Reber M.: “Benefits of Vertically Stacked Integrated Circuits for Sequential Logic”, IEEE, 1996, pp. 121-124.
Stern Jon M.: Design and Evaluation of an Epoxy Three-dimensional Multichip Module, IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, vol. 19, No. 1, Feb. 1996, pp. 188-194.
Bertin Claude L.: “Evaluation of a Three-dimensional Memory Cube System”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, No. 8, Dec. 1993, pp. 1006-1011.
Watanabe Hidehiro: “Stacked Capacitor Cells for High-density Dynamic RAMs”, IEDM, 1988, pp. 600-603.
Web Page: “Stacked Memory Modules”, IBM Technical Disclosure Bulletin, vol. 38, No. 5, 1995.
Thakur Shashidhar: “An Optimal Layer Assignment Algorithm for Minimizing Crosstalk for Three VHV Channel Routing”, IEDM, 1995, pp. 207-210.
Terril Rob: “3D Packaging Technology Overview and Mass Memory Applications”, IEDM, 1996, pp. 347-355.
Inoue Y.: “A Three-Dimensional Static RAM”, IEEE Electron Device Letters, vol. 7, No. 5, May 1986, pp. 327-329.
Reber M.: “Benefits of Vertically Stacked Integrated Circuits for Sequential Logic”, IEDM, 1996, pp. 121-124.
Kurokawa Takakazu: “3-D VLSI Technology in Japan and an Example: A Syndrome Decoder for Double Error Correction”, FGCS—Future, Generation, Computer, Systems, vol. 4, No. 2, 1988, pp. 145-155, Amsterdam, The Netherlands.
Abou-Samra S.J.: “3D CMOS SOI for High Performance Computing”, Low Power Electronics and Design Proceedings, 1998.
Yamazaki K.: “4-Layer 3-D IC Technologies for Parallel Signal Processing”, International Electron Devices Meeting Technical Digest, Dec. 9-12, 1990, pp. 25.5.1-25.5.4.
Schlaeppi H.P.: “nd Core Memories using Multiple Coincidence”, IRE Transactions on Electronic Computers, Jun. 1960, pp. 192-196.
Schlaeppppi H.P.: “Session V: Information Storage Techniques”, International Solid-State Circuits Conference, Feb. 11, 1960, pp. 54-55.
De Graaf C. et al.: “A Novel High-Density, Low-Cost Diode Programmable Read Only Memory,” IEDM, beginning at p. 189.
Peter K. Najl et al.: “A 256kb 3.0V 1T1MTJ Nonvolatile Magnetoresistive RAM, ” 2001 IEEE International Solid-State Circuits Conference, Digest of Technical Papers, ISSCC 2001/Session7/Technology Directions: Advanced Technologies/7.6, Feb. 6, 2001, pp. 122-123 (including enlargement of figures, totaling 9 pages), and associated Visual Supplement, pp. 94-95,4040-405 (enlargements of slides submitted, totaling 25 pages).
Kim C. Hardee et al.: “A Fault-Tolerant 30ns/375 mW 16K = 1 NMOS Static RAM, ” IEEE Journal of Solid-State Circuits, Oct. 1981, Vol. SC-16, No. 5, pp. 435-443.
Toshio Wada et al.: “A 15-ns 1024-Bit Fully Static MOS RAM, ” IEEE Journal of Solid-State Circuits, Oct. 1978, vol. SC-13, No. 5, pp. 635-639.
Camperi-Ginestet C: “Vertical Electrical Interconnection of Compound Semiconductor Thin-Film Devices to Underlying Silicon Circuitry”, IEEE Photonics Technology Letters, vol. 4, No. 9, Sep. 1992, pp. 1003-1006.
Akasaka Yoichi: Three-dimensional Integrated Circuit: Technology and Application Prospect, Microelectronics Journal, vol. 20, No.s 1-2, 1989, pp. 105-112.
Sakamoto Koji: “Architecture des Circuits a Trois Dimension (Architecture of Three Dimensional Devices)”, Bulletin of the Electrotechnical Laboratory, ISSN 0366-9092, vol. 51, No. 1, 1987, pp. 16-29.
Akasaka Yoichi: “Three-dimensional IC Trends”, Proceedings of the IEEE, vol. 74, No. 12, 1986, pp. 1703-1714.
Hongmei Wang et al.: “Submicron Super TFTs for 3-D VLSI Applications,” IEEE Electron Device Letters, Sep. 2000, pp. 439-441, vol. 21, No. 9, IEEE.
K.W. Lee et al.: “Three Dimensional Shared Memory Fabricated Using Wafer Stacking Technology,” 2000, IEEE.
John R. Lindsey et al.: “Polysilicon Thin Film Transistor for Three Dimensional Memory,” Electrochemical Society Meeting 198th, Oct. 2000, Phoenix, AZ.
Seiichi Aritome: “Advanced Flash Memory Technology and Trends for File Storage Application,” IEEE, 2000.
Toshiaki Yamanaka et al.: “Advanced TFT SRAM Cell Technology Using a Phase-Shift Lithography,” IEEE Transactions on Electron Devices, Jul. 1995, pp. 1305-1313, vol. 42, No. 7, IEEE.
Sung-Hoi Hur et al.: “A Poly-Si Thin-Film Transistor EEPROM Cell with a Folded Floating Gate,” IEEE Transactions on Electron Devices, Feb. 1999, pp. 436-438, vol. 46, No. 2, IEEE.
Jung-Dal Choi et al.: “A 0.15 μm NAND Flash Technology with 0.11 μm2 Cell Size for 1 Gbit Flash Memory.” IEEE, 2000.
H. Shirai et al.: “A 0.54 μm2 Self-Aligned, HSG Floating Gate Cell (SAHF Cell) for 256Mbit Flash Memories,” IEEE, 1995, pp. 653-656.
Takuya Kitamura et al.: “A Low Voltage Operating Flash Memory Cell with High Coupling Ratio Using Horned Floating Gate with Fine HSG,” IEEE, 1998, pp. 104-105.
Ken Takeuchi et al.: “A Duel-Page Programming Scheme for High-Speed Multigigabit-Scale NAND Flash Memories,” IEEE Journal of Solid-State Circuits, May. 2001, pp. 744-751, vol. 36, No. 5, IEEE.
C. Hayzelden et al.: “Silicide Formation and Silicide-Mediated Crystallization of Nickel-Implanted Amorphous Silicon Thin Films,” J. Appl. Phys., Jun. 15, 1993, pp. 8279-8289, 73 (12), 1993 American Institute of Physics.
David Burnett et al.: “An Advanced Flash Memory Technology on SOI,” 1998, pp. 983-986, IEEE.
A. Chatterjee et al.: “Sub-100nm Gate Length Metal Gate NMOS Transistors Fabricated by a Replacement Gate Process,” 1997, pp. 821-824, IEEE.
A. Chatterjee et al.: “CMOS Metal Replacement Gate Transistors Using Tantalum Pentoxide Gate Insulator,” 1998, pp. 777-780, IEEE.
David K. Y. Liu et al.: “Scaled Dielectric Antifuse Structure for Field-Programmable Gate Array Application,” IEEE Electron Device Letters, Apr. 1991, pp. 151-153, vol. 12, No. 4, IEEE.
Singh Jagar et al.: “Characterization of MOSFET's Fabricated on Large-Grain Polysilicon on Insulator,” Solid-State Electronics 45, 2001, pp. 743-749, Elsevier Science Ltd.
Zhonghe Jin et al.: “The Effects of Extended Heat Treatment on Ni Induced Lateral Crystallization of Amorphous Silicon Thin Films,” IEEE Transactions on Electron Devices, vol. 46, No. 1, Jan. 1999, pp. 78-82, IEEE.
A. Sato. et al. “A 0.5-μm EEPROM Cell Using Poly-Si TFT Technology,” IEEE Transactions on Electron Devices, vol. 40, No. 11, Nov. 1993, p. 2126.
Vivek Subramanian et al.: “High-Performance Germanium-Seeded Laterally Crystallized TFT's for Vertical Device Integration,” IEEE Transactions on Electron Devices, vol. 45, No. 9, Sep. 1998, pp. 1934-1939, IEEE.
Vivek Subramanian et al.: “Low-Leakage Germanium-Seeded Laterally-Crystallized Single-Grain 100-nm TFT's for Vertical Integration Applications,” IEEE Electron Devices Letters, vol. 20, No. 7, Jul. 1999, pp. 341-343, IEEE.
K.S. Kim et al.: “A Novel Duel String NOR (DuSNOR) Memory Cell Technology Scalable to the 256 Mbit and 1 Gbit Flash Memories,” IEDM, 1995, pp. 263-266, IEEE.
Boaz Eitan et al.: “NROM: A Novel Locallzed Trapping, 2-Bit Nonvolatile Memory Cell,” IEEE Electron Device Letters, vol. 21, No. 11, Nov. 2000, pp. 543-545, IEEE.
Marvin H. White et al.: “A Low Voltage SONOS Nonvolatile Semiconductor Memory Technology,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A., vol. 20, No. 2, Jun. 1997, pp. 190-195, IEEE.
Min-Hwa Chi et al.: “Programming and Erase with Floating-Body for High Density Low Voltage Flash EEPROM Fabricated on SOI Wafers,” Proceedings 1995 IEEE International SOI Conference, Oct. 1995, pp. 129-130.
S. Koyama: “A Novel CEll Structure for Giga-bit EPROMs and Flash Memories Using Polysilicon Thin Film Tansistors,” Symposium on VLSI Technology Digest of Technical Papers, 1992, pp. 44-45, IEEE.