Integrated heat dissipating enclosure for electronic product
May 14, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesHousing cooling system Method and apparatus for a modular integrated apparatus for multi-function components Multiple integrated service unit for communication system Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU) Electronic apparatus with improved heatsink arrangement Air-cooled electronic apparatus Box design for maximum heat dissipation Computer utilizing refrigeration for cooling Computer system that can be operated without a cooling fan Patent #: 6504719 InventorsAssigneeApplicationNo. 10437008 filed on 05/14/2003US Classes:174/17VA, Venting, absorption, expansion174/15.1, With cooling or fluid feeding, circulating or distributing174/50, BOXES AND HOUSINGS361/676, With cooling means361/688, With cooling means361/687, With cooling means361/695, Fan or blower361/700, Change of physical state361/704, Thermal conduction361/690, Air361/719, Circuit board mounted361/698And liquidExaminersPrimary: Estrada, Angel R.International ClassesH05K005/00H05K007/20 AbstractAn integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.Field of SearchBOXES AND HOUSINGSBoxes and housings With cooling or fluid feeding, circulating or distributing By heat pipe Venting, absorption, expansion And liquid With cooling means Liquid Change of physical state For module With cooling means With cooling fins Thermal conduction Through support means With cooling means Fluid With cooling means Fluid Air Air With heat exchanger unit With heat sink or cooling fins With cold plate or heat sink Heat sink Cooling plate or bar With fins Liquid cooled | |
