Article placement system
Apparatus for mounting electronic components
Apparatus for force fitting components into a workpiece
Programmable substrate transport for electronic assembly
Installation for automatic assembly and testing of electronic card modules
Electrical component placing apparatus and method of placing electrical component
Flexible production system comprising individually motorized mechanical modules whose operation is selected and synchronized by electronic means
Manipulating apparatus for manipulation of workpieces
Electronic components mounting apparatus
Electronic-component mounting system
ApplicationNo. 10306001 filed on 11/29/2002
US Classes:29/740, Chip component29/739, Means to fasten electrical component to wiring board, base, or substrate29/741, Multilead component29/743, Means to apply vacuum directly to position or hold work part29/833, By utilizing optical sighting device324/158.1, MISCELLANEOUS438/14WITH MEASURING OR TESTING
ExaminersPrimary: Arbes, Carl J.
Attorney, Agent or Firm
Foreign Patent References
AbstractAn electric-component mounting system including component-mounting devices arranged in an array and each having a component-holding head for holding an electric component, and a head-moving device to move the head, and a substrate-transferring device to move at least one substrate on which electric components are to be mounted, and wherein the substrate-transferring device stops each substrate at at least one stop position which corresponds to at least one of the component-mounting devices and at which operations of the component-mounting devices are concurrently performed on the at least one substrate. The substrate-transferring device includes a first transferring device to move each substrate along a path parallel to the array of the component-mounting devices and stop each substrate at least once during its movement along the path, and a second transferring device having a substrate-holding device to hold each substrate at each stop position and a holding-device moving device to reciprocate the substrate-holding device by a maximum distance smaller than a maximum distance of movement of each substrate by the first transferring device, so that each substrate is moved together with the substrate-holding device.