Artificial intelligence system for track defect problem solving
September 30, 2022. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of examining and testing an electric device such as an integrated or printed circuit Single semiconductor water transfer method and manufacturing system Plant maintenance with predictive diagnostics Alignment system and method of alignment by symmetrical and asymmetrical analysis Single semiconductor wafer transfer method and manufacturing system Automated defect classification system System that accesses a knowledge base by markup language tags Welding system and method of setting welding machine parameters Method and apparatus for wafer disposition based on systematic error modeling Apparatus for photolithography process with gas-phase pretreatment InventorsAssigneeApplicationNo. 10261650 filed on 09/30/2002US Classes:700/121, Integrated circuit production or semiconductor fabrication700/110, Defect analysis or recognition438/5, INCLUDING CONTROL RESPONSIVE TO SENSED CONDITION438/14, WITH MEASURING OR TESTING702/45, Flow metering250/310, Electron probe type376/215, By electronic signal processing circuitry (e.g., plural redundant circuits)700/59, Having optical sensing (e.g., image projection)382/149, Fault or defect detection715/512, Annotation control156/64, With measuring, testing, or inspecting716/9, Detailed placement (i.e., iterative improvement)438/782, With substrate handling during coating (e.g., immersion, spinning, etc.)702/81, Quality evaluation716/4, Testing or evaluating700/108, Performance monitoring706/52, Reasoning under uncertainty (e.g., fuzzy logic)257/773, Of specified configuration356/630, Thickness702/155, Dimensional determination382/112, Document or print quality inspection (e.g., newspaper, photographs, etc.)438/706, Vapor phase etching (i.e., dry etching)706/46, Knowledge representation and reasoning technique716/21Pattern exposureExaminersPrimary: Rodriguez, SaulAttorney, Agent or FirmInternational ClassesG06F019/00G01R031/26 AbstractA system and method facilitating lithography defect solution generation is provided. The invention includes a defect solution component and a defect alert component. The defect solution component provides potential solution(s) to a defect within the lithography process utilizing artificial intelligence technique(s) (e.g., Bayesian learning methods that perform analysis over alternative dependent structures and apply a score, Bayesian classifiers and other statistical classifiers, including decision tree learning methods, support vector machines, linear and non-linear regression and/or neural network).Other References
Field of SearchIntegrated circuit production or semiconductor fabricationTrainable system (e.g., self-learning, self-organizing) Neural network Integrated system (Computer Integrated Manufacturing (CIM) Performance monitoring Quality control Defect analysis or recognition INCLUDING CONTROL RESPONSIVE TO SENSED CONDITION WITH MEASURING OR TESTING For electrical fault detection ADAPTIVE SYSTEM KNOWLEDGE PROCESSING SYSTEM | |
