Patent ReferencesElectronic cooling Solid state blower Acoustic pump Piezoelectric fan Cryogenic vessel for cooling electronic components Ducted oscillatory blade fan Very high-acceleration tolerant circuit card packaging structure Electronic device having a cooling element Multi-chip cooling module and method Piezoelectric booster pump for a braking system InventorsAssigneeApplicationNo. 09602037 filed on 06/23/2000US Classes:165/80.4, Liquid cooled257/714, Liquid coolant361/699, Liquid417/436, TRANSVERSELY MOVABLE IMPELLING MEMBER (E.G., PADDLE)417/207, BY HEATING OF PUMPED FLUID361/695, Fan or blower361/704Thermal conductionExaminersPrimary: Leo, Leonard R.Foreign Patent References
International ClassH05K007/20AbstractAn arrangement for cooling an electronic assembly includes a circuit board, an enclosure member and at least one electromechanical actuator. The circuit board has a first surface, a second surface, and at least a first heat-generating element secured to the first surface. The circuit board further comprises at least one aperture extending between the first surface and the second surface. The enclosure member is secured to the circuit board so as to form a fluid tight barrier of a compartment defined at least in part by the enclosure member. The compartment includes a first subcompartment defined at least in part by the first surface and the enclosure member and a second subcompartment defined at least in part by the second surface and the enclosure member. The at least one electromechanical actuator is secured within the fluid type barrier and is operable to generate a flow movement in the direction of the at least one aperture when liquid is disposed in the fluid tight barrier. | |