Integrated back-end integrated circuit manufacturing assembly
February 27, 2022. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesManipulation and handling of integrated circuit dice Method of manufacturing an enclosed transceiver Apparatus for removing contaminants on electronic devices Semiconductor chip packaging system and a semiconductor chip packaging method using the same Stereolithographic method and apparatus for packaging electronic components and resulting structures Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process Method of performing back-end manufacturing of an integrated circuit device Patent #: 6730545 InventorAssigneeApplicationNo. 10085757 filed on 02/27/2002US Classes:700/121, Integrated circuit production or semiconductor fabrication438/106, PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR29/740, Chip component156/292, Of laminae having opposed facing areas out of contact134/1.1, Plasma cleaning257/660, With means to shield device contained in housing or package from charged particles (e.g., alpha particles) or highly ionizing radiation (i.e., hard X-rays or shorter wavelength)700/120, Stereolithography438/25, Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor438/112And encapsulatingExaminersPrimary: Picard, Leo P.Assistant: Jarrett, Ryan Attorney, Agent or FirmInternational ClassesG06F019/00H01L021/44 H01L021/48 H01L021/50 AbstractAn integrated back-end integrated circuit (IC) manufacturing assembly is disclosed. In one embodiment, the present invention has a front-of-line portion comprising a plurality of integrated sub-stations for operating on a first plurality of die-strips on an in-line basis to produce a second plurality of die-strips. The present embodiment further comprises an end-of-line portion coupled to the front-of-line portion and comprising a plurality of integrated sub-stations for operating on the second plurality of die-strips on an in-line basis to produce die-strip components. The present embodiment also comprises an in-line test portion coupled to the end-of-line portion for testing the die-strip components. The present embodiment further comprises a finish portion coupled to the in-line test portion and comprising a plurality of integrated sub-stations operating on tested die-strip components. In addition, camera systems perform automated visual inspection of dies on the die-strip and maintain a database that can be used for automated reject management.Other References
Field of SearchProduct assembly or manufacturingParticular manufactured product or operation Integrated circuit production or semiconductor fabrication Integrated system (Computer Integrated Manufacturing (CIM) PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR Assembly of plural semiconductive substrates each possessing electrical device Using strip lead frame Substrate dicing And encapsulating Making plural separate devices Including contaminant removal or mitigation Including adhesive bonding step Encapsulating | |
