U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Ceramic material resistant to halogen plasma and member utilizing the same

Patent 6916559 Issued on July 12, 2005. Estimated Expiration Date: Icon_subject July 17, 2022. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3588573

3649864

Ceramic composition for dielectric in multilayer capacitors
Patent #: 4550088
Issued on: 10/29/1985
Inventor: Park ,   et al.

Discharge lamp having a yttrium aluminum garnet discharge envelope
Patent #: 4841195
Issued on: 06/20/1989
Inventor: De With ,   et al.

Lead magnesium niobate ceramic dielectrics having low sintering temperatures
Patent #: 5011803
Issued on: 04/30/1991
Inventor: Park, et al.

Corrosion-resistant member for chemical apparatus using halogen series corrosive gas
Patent #: 5306895
Issued on: 04/26/1994
Inventor: Ushikoshi, et al.

High-pressure discharge lamp
Patent #: 5424609
Issued on: 06/13/1995
Inventor: Geven, et al.

High-pressure discharge lamp with ceramic discharge vessel and ceramic sealing means having lead-through comprising thin wires having a thermal coefficient of expansion substantially less than that of the ceramic sealing means
Patent #: 5455480
Issued on: 10/03/1995
Inventor: Bastian, et al.

Method for hot wall reactive ion etching using a dielectric or metallic liner with temperature control to achieve process stability
Patent #: 5637237
Issued on: 06/10/1997
Inventor: Oehrlein, et al.

High-pressure discharge lamp, method of its manufacture, and sealing material used with the method and the resulting lamp
Patent #: 5810635
Issued on: 09/22/1998
Inventor: Heider, et al.

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Inventors

Assignee

Application

No. 10198675 filed on 07/17/2002

US Classes:

428/697, Layer contains compound(s) of plural metals428/304.4, Composite having voids in a component (e.g., porous, cellular, etc.)428/332, Physical dimension specified428/446, Of silicon containing (not as silicon alloy)428/699, Next to second metal-compound-containing layer428/701, O-containing metal compound428/702, O-containing501/152, Yttrium, lanthanide, actinide, or transactinide containing (i.e., atomic numbers 39 or 57-71 or 89+)501/153, Aluminum compound containing313/622, Discharge device with diverse electrodes501/135, Alkaline earth or magnesium containing313/636, Envelope composition501/136, Titanate containing219/385, Combined with container, enclosure, or support for material to be heated313/623, Having electrode lead-in or electrode support sealed to envelope313/285, Supporting wire, rod, or tube supported by envelope216/67, Using plasma445/26, Arc tube making, e.g., fluorescent lamp315/248, Induction-type discharge device load428/696Halogen-containing

Examiners

Primary: Stein, Stephen

Attorney, Agent or Firm

Foreign Patent References

  • 02-017684 JP 01/01/1990
  • 03-067057 JP 06/01/1991
  • 403218963 JP 09/01/1991
  • 03-275561 JP 12/01/1991
  • 04-233154 JP 08/01/1992
  • 05-217946 JP 08/01/1993
  • 05-251365 JP 09/01/1993
  • 5-251365 JP 09/01/1993
  • 06-166563 JP 06/01/1994
  • 06-168704 JP 06/01/1994
  • 06-196131 JP 07/01/1994
  • 03-060138 JP 08/01/1994
  • 07-021990 JP 01/01/1995
  • 07-041359 JP 02/01/1995
  • 07-103482 JP 04/01/1995
  • 07-176524 JP 07/01/1995
  • 07-278851 JP 10/01/1995
  • 8-027566 JP 01/01/1996
  • 08-037180 JP 02/01/1996
  • 08-298099 JP 11/01/1996
  • 08-311692 JP 11/01/1996
  • 08-325054 JP 12/01/1996
  • 08-337467 JP 12/01/1996
  • 09-293774 JP 11/01/1997

International Classes

B32B009/00
C04B035/505

Abstract

A member used within a plasma processing apparatus and exposed to a plasma of a halogen gas such as BCl3 or Cl2 is formed from a sintered body of metals of Group IIIa of Periodic Table such as Y, La, Ce, Nd and Dy, and Al and/or Si, for example, 3Y2O3.5Al2O3, 2Y2O3.Al2O3, Y2O3.Al2O3 or disilicate or monosilicate, and in particular, in this sintered body, the content of impurity metals of Group IIa of Periodic Table contained in the sintered body is controlled to be 0.15 wt % or more in total. Specifically, for this member, an yttrium-aluminum-garnet sintered body having a porosity of 3% or less and also having a surface roughness of 1 μm or less in center line average roughness Ra is utilized.

Other References

  • Partial Translation of: Taikabutsu 47 (3) 149-153 (1995).
  • Partial Translation of: Ceramic 30 (11), 999-1001 (1995).
  • Partial Translation of: VSU Process Device Handbook, Kogyochosakai, (Jun. 1990).
  • Communication of the American Ceramic Society C-168 (1993).
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