Method and equipment for welding conductors to substrates
January 30, 2023. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesWear resistant wheel for track laying vehicle Method for welding by means of laser light Security device for transporting documents of value Recording and reproducing apparatus using flexible disc Electro-optical assembly IC package hold-down fixture Method and apparatus for laser masking of lead bonding Optical module with fluxless laser reflow soldered joints Optical module with tolerant wave soldered joints Laser reflow soldering process with lead-tin solder pads InventorsAssigneeApplicationNo. 10354016 filed on 01/30/2003US Classes:219/121.64, Methods305/137, Including structure to engage track (e.g., wear surface, cushion)109/25, With marking devices360/130.3, Pressure element359/894, OPTICAL APERTURE OR TUBE, OR TRANSPARENT CLOSURE62/158, Time delay of condition sensing or control operation228/157, Spreading or expanding work between bond joints (e.g., honeycomb or heat exchanger making, etc.)148/535, Aluminum(Al) or aluminum base alloy present360/244.5Actuator mount region detailExaminersPrimary: Heinrich, Samuel M.Attorney, Agent or FirmForeign Patent References
International ClassesB23K026/22B23K026/32 AbstractA method of welding conductors to substrates with a stud attached to the substrate consists in welding to the substrate a stud which has the same composition by volume as the conductor and fastening the conductor to the stud by laser spot welding. | |
