U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

BICMOS technology on SIMOX wafers

Patent 6888221 Issued on May 3, 2005. Estimated Expiration Date: Icon_subject April 14, 2024. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Complementary bipolar transistor structure and method for manufacture
Patent #: 4997776
Issued on: 03/05/1991
Inventor: Harame, et al.

5118634

Semiconductor device having bipolar transistor free from leakage current across thin base region
Patent #: 5698890
Issued on: 12/16/1997
Inventor: Sato

Self-aligned SiGe NPN with improved ESD robustness using wide emitter polysilicon extension
Patent #: 6441462
Issued on: 08/27/2002
Inventor: Lanzerotti, et al.

Structure for reduction of base and emitter resistance and related method
Patent #: 6486532
Issued on: 11/26/2002
Inventor: Racanelli

Bipolar transistor and manufacturing method thereof Patent #: 6521974
Issued on: 02/18/2003
Inventor: Oda, et al.

Inventors

Application

No. 10709114 filed on 04/14/2004

US Classes:

257/565, BIPOLAR TRANSISTOR STRUCTURE257/592, With base region having specified doping concentration profile or specified configuration (e.g., inactive base more heavily doped than active base or base region has constant doping concentration portion (e.g., epitaxial base))438/205, Plural bipolar transistors of differing electrical characteristics438/313, Complementary bipolar transistors438/340Making plural bipolar transistors of differing electrical characteristics

Examiners

Primary: Abraham, Fetsum

Attorney, Agent or Firm

International Class

H01L027/082

Abstract

A method and structure for a bipolar transistor comprising a patterned isolation region formed below an upper surface of a semiconductor substrate and a single crystal extrinsic base formed on an upper surface of the isolation region. The single crystal extrinsic base comprises a portion of the semiconductor substrate located between the upper surface of the isolation region and the upper surface of the semiconductor substrate. The bipolar transistor further comprises a single crystal intrinsic base, wherein a portion of the single crystal extrinsic base merges with a portion of the single crystal intrinsic base. The isolation region electrically isolates the extrinsic base from a collector. The intrinsic and extrinsic bases separate the collector from an emitter. The extrinsic base comprises epitaxially-grown silicon. The isolation region comprises an insulator, which comprises oxide, and the isolation region comprises any of a shallow trench isolation region and a deep trench isolation region.

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