U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Reducing noise effects in circuit boards

Patent 6844505 Issued on January 18, 2005. Estimated Expiration Date: Icon_subject November 4, 2022. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Bus bar assembly with discrete capacitor elements
Patent #: 4436953
Issued on: 03/13/1984
Inventor: Gottlieb

Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
Patent #: 5027253
Issued on: 06/25/1991
Inventor: Lauffer, et al.

In situ method for forming a capacitive PCB
Patent #: 5261153
Issued on: 11/16/1993
Inventor: Lucas

Printed circut board with embedded decoupling capacitance and method for producing same
Patent #: 5796587
Issued on: 08/18/1998
Inventor: Lauffer, et al.

Multilayer ceramic circuit boards including embedded capacitors
Patent #: 5953203
Issued on: 09/14/1999
Inventor: Tormey, et al.

Individual embedded capacitors for laminated printed circuit boards
Patent #: 6068782
Issued on: 05/30/2000
Inventor: Brandt, et al.

Method for producing a circuit board with embedded decoupling capacitance
Patent #: 6256850
Issued on: 07/10/2001
Inventor: Lauffer, et al.

Integrated method for containment of radiated electromagnetic radiation
Patent #: 6329590
Issued on: 12/11/2001
Inventor: Alexander, et al.

Electronic assembly with trench structures and methods of manufacture
Patent #: 6388207
Issued on: 05/14/2002
Inventor: Figueroa, et al.

Electronic package having embedded capacitors and method of fabrication therefor
Patent #: 6407929
Issued on: 06/18/2002
Inventor: Hale, et al.

More ...

Inventors

Assignee

Application

No. 10287116 filed on 11/04/2002

US Classes:

174/260, With electrical device174/261, With particular conductive connection (e.g., crossover)174/262, Feedthrough361/761, Component within printed circuit board361/763, Capacitor and electrical component361/780, Different voltage layers174/72B, Bus bars174/256, With particular material361/306.3, For multilayer capacitor257/700Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)

Examiners

Primary: Cuneo, Kamand
Assistant: Patel, I B

Attorney, Agent or Firm

International Class

H05K 116

Abstract

A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.

Other References

  • U.S. Appl. No. 10/630,886, Alexander et al., filed Jul. 30, 2003.
  • U.S. Appl. No. 10/670,829, Jun Fan et al., filed Sep. 25, 2003.
PatentsPlus Images
Enhanced PDF formats
loading...
PatentsPlus: add to cart
PatentsPlus: add to cartSearch-enhanced full patent PDF image
$9.95more info
PatentsPlus: add to cart
PatentsPlus: add to cartIntelligent turbocharged patent PDFs with marked up images
$16.95more info
 
Sign InRegister
Username  
Password   
forgot password?