Patent ReferencesBus bar assembly with discrete capacitor elements Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards In situ method for forming a capacitive PCB Printed circut board with embedded decoupling capacitance and method for producing same Multilayer ceramic circuit boards including embedded capacitors Individual embedded capacitors for laminated printed circuit boards Method for producing a circuit board with embedded decoupling capacitance Integrated method for containment of radiated electromagnetic radiation Electronic assembly with trench structures and methods of manufacture Electronic package having embedded capacitors and method of fabrication therefor InventorsAssigneeApplicationNo. 10287116 filed on 11/04/2002US Classes:174/260, With electrical device174/261, With particular conductive connection (e.g., crossover)174/262, Feedthrough361/761, Component within printed circuit board361/763, Capacitor and electrical component361/780, Different voltage layers174/72B, Bus bars174/256, With particular material361/306.3, For multilayer capacitor257/700Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)ExaminersPrimary: Cuneo, KamandAssistant: Patel, I B Attorney, Agent or FirmInternational ClassH05K 116AbstractA circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.Other References
Field of SearchWith electrical deviceFeedthrough With particular conductive connection (e.g., crossover) Hollow (e.g., plated cylindrical hole) Preform in hole Connection of components to board Component within printed circuit board Capacitor and electrical component Capacitor and resistor Integrated circuit Different voltage layers Having passive component Power, voltage, or current layer Assembling to base an electrical component, e.g., capacitor, etc. Manufacturing circuit on or in base Devices held in place by clamping Device held in place by clamping | |