Continuous sputtering apparatus
Substrate processing apparatus
Holding apparatus for holding an article such as a semiconductor wafer
Method of holding substrate and substrate holding system
Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer
Substrate for information recording media Patent #: 6391418
ApplicationNo. 09498375 filed on 02/04/2000
US Classes:204/298.15, Specified work holder204/298.25, Multi-chamber (e.g., including air lock, load/unload chamber, etc.)118/728, Work support118/729, Moving work support118/732, Porous118/719, Multizone chamber118/724, By means to heat or cool118/500, WORK HOLDERS, OR HANDLING DEVICES269/21, Vacuum-type holding means279/3, VACUUM269/91, Clamp couple element with fastening means438/691, Combined mechanical and chemical material removal428/64.7Polycarbonate containing
ExaminersPrimary: McDonald, Rodney G.
Attorney, Agent or Firm
Foreign Patent References
International ClassesC23C 1454
AbstractIn an optical disk substrate film-formation apparatus which prepared an optical disk by forming a thin film on a substrate, the optical disk substrate is held by a holder section. A contact support surface is provided to the holder section which closely contacts at least a portion of the surface of the optical disk substrate rear to the surface where the think film is formed.