Nonlinear image distortion correction in printed circuit board manufacturing
Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
Dimensionally stable core for use in high density chip packages and a method of fabricating same
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
Multilayer printed wiring board and its production process, resin composition for filling through-hole Patent #: 6376052
ApplicationNo. 10202738 filed on 07/24/2002
US Classes:29/847, With selective destruction of conductive paths29/825, Conductor or circuit manufacturing29/846, Manufacturing circuit on or in base430/30, INCLUDING CONTROL FEATURE RESPONSIVE TO A TEST OR MEASUREMENT428/206, Including particulate material438/106, PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR428/209Including metal layer
ExaminersPrimary: Arbes, Carl J.
International ClassH05K 302
AbstractDisclosed herein are methods for modifying an inner-layer circuit feature of a printed circuit board. A trimming point on the inner-layer circuit feature is identified using an x-ray inspection system. The coordinates of the trimming point are then related to the coordinates of a visible reference marker on the printed circuit board. Next, the relationship between the visible reference marker and the trimming point is used to position a cutting tool over the trimming point. Finally, the cutting tool is used to make one or more cuts into the printed circuit board, until the inner-layer circuit feature is acceptably modified at the trimming point.
Field of SearchConductor or circuit manufacturing
Manufacturing circuit on or in base
With selective destruction of conductive paths
Assembling formed circuit to base
Assembling to base an electrical component, e.g., capacitor, etc.
By metal fusion
By forming conductive walled aperture in base
INCLUDING CONTROL FEATURE RESPONSIVE TO A TEST OR MEASUREMENT