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US Patent 6766260 - Mass flow ratio system and method
US Patent Issued on July 20, 2004
Estimated Patent Expiration Date:
January 4, 2022Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
Estimated Patent Expiration Date:
January 4, 2022Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractA system for dividing a single mass flow, including an inlet adapted to receive the single mass flow and at least two flow lines connected to the inlet. Each flow line includes a flow meter and a valve. The system also includes a controller programmed to receive a desired ratio of flow through a user interface, receive signals indicative of measured flow from the flow meters, calculate an actual ratio of flow through the flow lines based upon the measured flows, and compare the actual ratio to the desired ratio. The controller is also programmed to calculate the desired flow through at least one of the flow lines if the actual ratio is unequal to the desired ratio, and provide a signal indicative of the desired flow to at least one of the valves.Other References
| InventorsAssigneeApplicationNo. 10037882 filed on 01/04/2002US Classes:702/45Flow meteringField of Search702/45, Flow metering60/781, Solid fuel137/487, Control by pressures across flow line valve137/875, Pivoted valve or deflector137/88, Mixture condition maintaining or sensing73/197, Compound meter73/861, VOLUME OR RATE OF FLOW141/8, Vacuum141/66, With filling with gas141/7, With evacuation of container700/277, Multiple zones406/14, Responsive to velocity or pressure change in conveying fluid432/198, Means supplying a protective or treating agent other than or additional to air118/715, GAS OR VAPOR DEPOSITION438/710, By creating electric field (e.g., plasma, glow discharge, etc.)422/111Material is an input to contact zoneExaminersPrimary: Barlow, JohnAssistant: Lau, Tung S Attorney, Agent or FirmUS Patent References1767588, 1886575, 2288297, 2314152, 2638912, 2661756, 2780414, 3092127, 3438385, 3556126, 3762428, 4369031, Gas control system for chemical vapor deposition systemIssued on: 01/18/1983 Inventor: Goldman , et al.5031674, Fluid flow control method and apparatus for minimizing particle contamination Issued on: 07/16/1991 Inventor: Mack5165450, Means for separating a fluid stream into two separate streams Issued on: 11/24/1992 Inventor: Marrelli5240046, Fluid flow control method and apparatus for minimizing particle contamination Issued on: 08/31/1993 Inventor: Mack5307833, Method and apparatus for automatically transferring and measuring wet steam between priority and secondary users Issued on: 05/03/1994 Inventor: Stoy, et al.5449495, Nitrogen oxide removal control apparatus Issued on: 09/12/1995 Inventor: Goto5453124, Programmable multizone gas injector for single-wafer semiconductor processing equipment Issued on: 09/26/1995 Inventor: Moslehi, et al.5927321, System for measuring and controlling gas mass flow Issued on: 07/27/1999 Inventor: Bergamini6333272Gas distribution apparatus for semiconductor processing Issued on: 12/25/2001 Inventor: McMillin, et al. Foreign Patent References
International ClassG06F 1900 |
