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US Patent 6743972 - Heat dissipating IC devices
US Patent Issued on June 1, 2004
Estimated Patent Expiration Date:
August 10, 2021Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
Estimated Patent Expiration Date:
August 10, 2021Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractHeat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits. | InventorApplicationNo. 09927276 filed on 08/10/2001US Classes:136/201, Processes136/204, Including additional heat exchange means136/205, Electric power generator257/713, For integrated circuit257/717, Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)257/719, Pressed against semiconductor element257/722, With fins257/930, THERMOELECTRIC (E.G., PELTIER EFFECT) COOLING62/3.2Thermoelectric; e.g., peltier effectField of Search136/203, Peltier effect device136/205, Electric power generator136/201, Processes136/204, Including additional heat exchange means136/200, THERMOELECTRIC136/225, Having strip, film or plate-type thermocouples62/3.2, Thermoelectric; e.g., peltier effect62/3.3, Heat pump, selective heating and cooling257/930, THERMOELECTRIC (E.G., PELTIER EFFECT) COOLING257/712, With provision for cooling the housing or its contents257/713, For integrated circuit257/717, Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)257/718, Heat dissipating element held in place by clamping or spring means257/719, Pressed against semiconductor element257/722With finsExaminersPrimary: Ryan, PatrickAssistant: Parsons, Thomas H. Attorney, Agent or FirmUS Patent References3635037, 4092614, Semiconductor laser device equipped with a silicon heat sinkIssued on: 05/30/1978 Inventor: Sakuma, et al.4211888, Arrangement with several thermal elements in series connection Issued on: 07/08/1980 Inventor: Stein , et al.5022928, Thermoelectric heat pump/power source device Issued on: 06/11/1991 Inventor: Buist5032897, Integrated thermoelectric cooling Issued on: 07/16/1991 Inventor: Mansuria, et al.5051865, Multi-layer semiconductor device Issued on: 09/24/1991 Inventor: Kato5061987, Silicon substrate multichip assembly Issued on: 10/29/1991 Inventor: Hsia5229327, Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies therefor Issued on: 07/20/1993 Inventor: Farnworth5598031, Electrically and thermally enhanced package using a separate silicon substrate Issued on: 01/28/1997 Inventor: Groover, et al.5637921, Sub-ambient temperature electronic package Issued on: 06/10/1997 Inventor: Burward-Hoy5714791, On-chip Peltier cooling devices on a micromachined membrane structure Issued on: 02/03/1998 Inventor: Chi, et al.5793107, Polysilicon pillar heat sinks for semiconductor on insulator circuits Issued on: 08/11/1998 Inventor: Nowak5837929, Microelectronic thermoelectric device and systems incorporating such device Issued on: 11/17/1998 Inventor: Adelman5956569, Integrated thermoelectric cooler formed on the backside of a substrate Issued on: 09/21/1999 Inventor: Shiu, et al.6080608, Polysilicon pillar heat sinks for semiconductor on insulator circuits Issued on: 06/27/2000 Inventor: Nowak6094919, Package with integrated thermoelectric module for cooling of integrated circuits Issued on: 08/01/2000 Inventor: Bhatia6121661, Silicon-on-insulator structure for electrostatic discharge protection and improved heat dissipation Issued on: 09/19/2000 Inventor: Assaderaghi, et al.6162659, Method for manufacturing a package structure having a heat spreader for integrated circuit chips Issued on: 12/19/2000 Inventor: Wu6166411, Heat removal from SOI devices by using metal substrates Issued on: 12/26/2000 Inventor: Buynoski6196002Ball grid array package having thermoelectric cooler Issued on: 03/06/2001 Inventor: Newman, et al. International ClassesH01L 3534H01L 3528 H01L 3530 H01L 2334 F25B 2102 |
