Heat dissipating IC devices
August 10, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3635037 Semiconductor laser device equipped with a silicon heat sink Arrangement with several thermal elements in series connection Thermoelectric heat pump/power source device Integrated thermoelectric cooling Multi-layer semiconductor device Silicon substrate multichip assembly Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies therefor Electrically and thermally enhanced package using a separate silicon substrate Sub-ambient temperature electronic package InventorApplicationNo. 09927276 filed on 08/10/2001US Classes:136/201, Processes136/204, Including additional heat exchange means136/205, Electric power generator257/713, For integrated circuit257/717, Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)257/719, Pressed against semiconductor element257/722, With fins257/930, THERMOELECTRIC (E.G., PELTIER EFFECT) COOLING62/3.2Thermoelectric; e.g., peltier effectExaminersPrimary: Ryan, PatrickAssistant: Parsons, Thomas H. Attorney, Agent or FirmInternational ClassesH01L 3534H01L 3528 H01L 3530 H01L 2334 F25B 2102 AbstractHeat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits.Field of SearchPeltier effect deviceElectric power generator Processes Including additional heat exchange means THERMOELECTRIC Having strip, film or plate-type thermocouples Thermoelectric; e.g., peltier effect Heat pump, selective heating and cooling THERMOELECTRIC (E.G., PELTIER EFFECT) COOLING With provision for cooling the housing or its contents For integrated circuit Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer) Heat dissipating element held in place by clamping or spring means Pressed against semiconductor element With fins | |
