Thermally stable, weather-resistant polyamide moulding compositions
Patent 6737462 Issued on May 18, 2004. Estimated Expiration Date: 
November 20, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
November 20, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2510777 2705227 3431236 3519595 3679624 3691131 3814728 InventorsAssigneeApplicationNo. 09989347 filed on 11/20/2001US Classes:524/414, Phosphorus atom DNRM524/401, Inorganic compound devoid of a silicon atom DNRM524/435, Transition metal atom (i.e., Fe, Co, Ni)524/436Group IIA metal DNRM (i.e., Be, Mg, Ca, Sr, Ba)ExaminersPrimary: Yoon, Tae H.Attorney, Agent or FirmForeign Patent References
International ClassesC08K 332C08K 310 C08K 316 AbstractThe invention relates to thermally stable, weather-resistant polyamide moulding compositions containing as stabiliser, a mixture of a copper halide, one or more halogen compounds and hypophosphorous acid or an alkali metal or alkaline earth metal salt of this acid, wherein the individual components of the stabiliser mixture are added in an amount such that the molar amount of halogen contained in the moulding composition is greater than or equal to six times the molar amount of and less than or equal to fifteen times the molar amount of copper contained in the moulding composition and the molar amount of phosphorus is greater than or equal to the molar amount of and less than or equal to ten times the molar amount of copper contained in the moulding composition.Other References
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