Integrated quantum cold point coolers
December 13, 2021. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3779446 3808670 3879838 Method for the manufacturing of thermoelectric modules Method of fabricating surface micromachined structures Dehumidifying apparatus with electronic refrigeration unit Thermoelectric cooler assisted soldering Thermoelectric device Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms InventorApplicationNo. 10015237 filed on 12/13/2001US Classes:228/134Applying molten filler from top reservoirExaminersPrimary: Dunn, TomAssistant: Cooke, Colleen P. Attorney, Agent or FirmForeign Patent References
International ClassB23K 100AbstractA method for forming a thermoelement for a thermoelectric cooler is provided. In one embodiment a first substrate having a plurality of pointed tips separated by valleys wherein the substrate is covered by a metallic layer, portions of the metallic layer is covered by an insulator, and other portions of the metallic layer are exposed is formed. The other portions of the metallic layer that are exposed are covered with a thermoelectric material overcoat. A second substrate of thermoelectric material is then fused to the pointed tip side of the first substrate by, for example, heating the back of the first substrate to melt the thermoelectric material overcoat or by passing current through the pointed tips to induce Joule heating and thereby melt the thermoelectric material overcoat.Other References
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