U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Lens assembly for endoscopic lens system

Patent 6695775 Issued on February 24, 2004. Estimated Expiration Date: Icon_subject June 7, 2022. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Endoscopic instrument with improved closure window
Patent #: 5536244
Issued on: 07/16/1996
Inventor: Muller, et al.

Lens unit cemented at circumference of each of lens elements and optical system including the same
Patent #: 5570237
Issued on: 10/29/1996
Inventor: Sato

Lens device with anti-fogging
Patent #: 5894369
Issued on: 04/13/1999
Inventor: Akiba, et al.

UV-resistant jointing technique for lenses and mounts
Patent #: 5991101
Issued on: 11/23/1999
Inventor: Holderer, et al.

Endoscope video camera head which can be autoclaved
Patent #: 6080101
Issued on: 06/27/2000
Inventor: Tatsuno, et al.

Endoscope capable of being autoclaved Patent #: 6547721
Issued on: 04/15/2003
Inventor: Higuma, et al.

Inventors

Assignee

Application

No. 10/163527 filed on 06/07/2002

US Classes:

600/176, Having particular distal lens or window359/513, Sealing600/169Fog prevention

Examiners

Primary: Leubecker, John P.

Attorney, Agent or Firm

International Classes

G02B 7/02 (20060101)
G02B 23/24 (20060101)

Foreign Application Priority Data

2001-06-07 JP

Abstract

An optical lens assembly containing a plural number of lens elements for an optical system to be incorporated into a tip end portion of an endoscopic insertion instrument. Of a plural number of lenses which constitute an optical system, a metal film layer is formed on confronting outer peripheral surface portions of at least two adjacently located lenses, outside respective effective lens areas, and the two adjacently located lenses are assembled and fixedly bonded together by applying solder to the outer peripheral surface portions with a metal film layer.

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